Hitachi's high performance FIB-SEM provides unparalleled nano-analyses of devices and functional materials !!
Legendary Hitachi reliability and performance in an integrated system (Ultra-high performance FIB and high resolution FE-SEM) enabling high-throughput specimen preparation, high resolution imaging and analysis and precision nanofabrication. New low-damage fabrication techniques have been developed for materials sensitive to electron irradiation. Innovations in sample loading, sample navigation, and Micro-sampling increase analysis efficiency(*1).
Features |
Ultra-high performance FIB
Low CsFIB optics(*2) deliver 50nA or more of beam current (@40kV) in an about 1µm spot-size. The high current enables unconventional large-area milling, hard material fabrication and high throughput multiple specimen preparation.
New Micro-sampling
Hitachi's patented Micro-sampling technology provides smooth probe motion. Also, the probe can be used for newly developed absorbed current imaging(*1) to aid fault isolation.
High precision end-point detection
High resolution SEM allows high precision end-point detection. Section-view function, which displays an outline of the cross-section utilizing the real-time FIB image, is ideal for preparing electron irradiation sensitive specimens like low-K material.
High resolution SEM
Hitachi's unparalleled SEM column and detector design(*2) enables high resolution SEM imaging during and after FIB fabrication.
Holder compatibility with TEM/STEM(*1)(*2)
A side entry STEM/TEM-type staqe(*1) allows the use of the same specimen holder (compatible with NB5000 and Hitachi TEM/STEM). No tweezer handling of specimen during transfer results in higher throughput TEM/STEM analysis.
(*1):Optional accessory
(*2):Hitachi patent
Low Cs FIB optics: patent pending, Micro-sampling: JP2774884/US5270552, Section-view function: patent pending, SEM column and detector design: JP3081393/US5387793, Holder compatibility: JP2842083
日立高性能聚焦离子束-扫描电子显微镜的融合是纳米材料、功能材料的加工分析利器!
日立产品高稳定性与高性能的融合(超高性能聚焦离子束和超高分辨率场发射电子显微镜)使得样品制备、高分辨观察、分析以及精准纳米尺度加工成为可能。全新开发的低损伤加工技术适用于电子辐照敏感材料。在样品装载、样品导航和微小样品加工方面的创新,可提高分析效率*。
*:选配件
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