Helios G4 FX 等离子聚焦离子束 (FIB) 系统

Helios G4 FX 属于业界领先的 Helios DualBeam 系列的第四代产品。它经过精心设计，通过提供zei好的一体化 STEM 样品制备和成像解决方案来满足科学家和工程师的需求。Helios G4 FX 将创新的 Elstar 电子镜筒与用于极高分辨率成像和zei高材料对比度的大电流 UC+ 技术，用于亚 3Å 原位低 kV STEM 成像的透镜内 STEM 4，以及卓越的 Phoenix 离子镜筒结合在一起，实现zei快、zei简单、zei精确的高品质样品制备。除了zei先进的电子和离子光学元件，Helios G4 FX 还采用了一套先进的技术，可以进行简单和一致的高分辨率 S/TEM 和原子探针断层扫描 (APT) 样品制备，以及zei高质量的亚表层和三维表征，即使针对zei具挑战性的样品。

Electron optics

 · Elstar extreme high-resolution field emission SEM column with:

 - Immersion magnetic objective lens

 - High-stability Schottky field emission gun to provide stable high-resolution analytical currents

 - UC+ monochromator technology

 · 60 degree dual objective lens with pole piece protection allows tilting larger samples

 · Automated heated apertures to ensure cleanliness and touch free aperture exchange

 · Electrostatic scanning for higher deflection linearity and speed

 · ConstantPower™ lens technology for higher thermal stability

 · Integrated Fast Beam Blanker*

 · Beam deceleration with stage bias from 0 V to -4 kV

 · Minimum source lifetime: 12 month 

Electron beam resolution

 · At optimum WD:

 - 0.3 nm at 30 kV STEM in-lens mode

 - 0.6 nm at 2 kV

 - 0.7 nm at 1 kV

 - 1.0 nm at 500 V (ICD)

 · At coincident point:

 - 0.6 nm at 15 kV

 - 1.2 nm at 1 kV

Electron beam parameter space

 · Electron beam current range: 0.8 pA to 100 nA

 · Accelerating voltage range:  200 V – 30 kV

 · Landing energy range: 20 eV – 30 keV

 · Maximum horizontal field width: 2.3 mm at 4 mm WD 

Ion optics 

Phoenix ion column with superior high current and low voltage performance

 · Ion beam current range: 0.1 pA – 65 nA

 · Accelerating voltage range:  500 V – 30 kV

 · 2-stage differential pumping

 · Time-of-flight (TOF) correction

 · 15-position aperture strip

 · Maximum horizontal field width: 0.9 mm at beam coincidence point

 · Minimum source lifetime: 1,000 hours Ion beam resolution at coincident point

 · 4.0 nm at 30 kV using preferred statistical method

 · 2.5 nm at 30 kV using selective edge method

Detectors

 · Retractable In-Lens STEM 4 detector with BF/ DF/ HAADF segments

 · Elstar in-lens SE/BSE detector (TLD-SE, TLD-BSE)

 · Elstar in-column SE/BSE detector(ICD) 

 · Elstar in-column BSE detector (MD) 

 · Everhart-Thornley SE detector (ETD)

 · IR camera for viewing sample/ column

 · High performance ion conversion and  electron (ICE) detector for secondary ions (SI) and electrons (SE)

 · In-chamber Nav-Cam™ sample navigation camera

 · Retractable low voltage, high contrast directional solid-state backscatter electron detector (DBS)*

 · Integrated beam current measurement

Stage and sample

Ultra high precision 5-axis piezo motorized stage:

 · XY range: 100 mm

 · Z range: 20 mm

 · Rotation: 360° (endless)

 · Tilt precision: 0.1° (between 50° and 54°)

 · Tilt range: -10° to +60°

 · XY repeatability: 0.5 μm

 · Max sample weight: 200 g (including sample holder)

 · Max sample size: 100 mm with full rotation

 · Compucentric rotation and tiltAutomated CompuStage with double-flip holder:

 · 5 axis CompuStage with STEM holder, equipped with automated insert/retract mechanism and air lock for fast TEM grid exchange without breaking system vacuum

Vacuum system

 · Complete oil-free vacuum system

 · Chamber vacuum: < 2.6×10-6 mbar (after 24 h pumping)

 · Evacuation time: < 5 minutes

Chamber

 · E- and I-beam coincidence point at analytical WD (4 mm SEM)

 · Ports: 21

 · Inside width: 379 mm

 · Integrated plasma cleaner

Sample holders

 · Multi-stub holder

 · Multi-sample cross-sectional holder*

 · Single stub mount, mounts directly onto stage

 · Various wafer and custom holder(s) available by request*

Image processor

 · Dwell time range from 25 ns – 25 ms/pixel

 · Up to 6144 × 4096 pixels

 · File type: TIFF (8, 16, 24-bit), BMP or JPEG standard

 · SmartSCAN™ (256 frame average or integration, line integration and averaging, interlaced scanning)

 · DCFI (Drift Compensated Frame Integration)

System control

 · 64-bit GUI with Windows 7, keyboard, optical mouse

 · Up to four live images showing independent beams and/or signals. Live color signal mixing

 · Local language support: Check with your local FEI Sales representatives for available language packs

 · Two 24-inch widescreen monitors (1920×1200 pixels) for system GUI and full-screen image

 · Microscope controlling and support computers seamlessly sharing one keyboard, mouse and monitors

 · Joystick*

 · Multifunctional control panel*

 · Remote control and imaging*

Supporting software

 · ‘Beam per view’ graphical user interface concept, with up to 4 simultaneously active quads

 · FEI SPI™ (simultaneous FIB patterning and SEM imaging), iSPI™ (intermittent SEM imaging and FIB patterning), iRTM™ (integrated real time monitor) 

and FIB immersion mode for advanced, real-time SEM and FIB process monitoring and endpointing

· Patterns supported: lines, rectangles, polygons, circles, donut, cross- section and cleaning cross-section

 · Directly imported BMP file or stream file for 3D milling and deposition

 · Material file support for ‘minimum loop time’, beam tuning and independent overlaps

 · Image registration enabling sample navigation in an imported image

 · Sample navigation on an optical image

Accessories (standard)

 · MultiChem™: up to 6 chemistries on the same unit for advanced etching and deposition controls

 · EasyLift™ EX for precise in situ sample manipulation

 · Automatic loadlock with sample holder set for fast sample transfer

 · Specimen height detection

Accessories (optional)

 · GIS (Gas Injection System) – Solutions:

 · Single GIS: up to 4 independent units for enhanced etching or deposition

 · GIS – Beam chemistry options**

 - Platinum deposition

 - Tungsten deposition

 - Carbon deposition

 - Insulator deposition II

 - Gold deposition

 - Enhanced Etch™ (iodine, patented)

 - Insulator enhanced etch (XeF2)

 - Delineation Etch™ (patented)

 - Selective carbon mill (patented)

 - Empty crucibles for FEI approved user supplied materials

 - More beam chemistries available upon request

· FIB Charge Neutralizer

 · Analysis: EDS, WDS

 · FEI acoustic enclosure

 · FEI CryoCleaner

Software options*

 · Guided TEM sample preparation workflow

 · iFast advanced automation suite for DualBeam

 · MAPS™ for automatic acquisition of large images and optional correlative work

 · AutoTEM™ wizard automated sample preparation with section wizard

 · NanoBuilder™ – advanced FEI proprietary CAD based (GDSII) solutions for FIB and beam deposition optimized nanoprototyping of complex structures

 · AutoSlice and View™ – automated sequential mill and view to collect series of slices images or EDS maps for 3D reconstruction

 · Avizo for FEI – 3D reconstruction and analysis software

 · CAD navigation

 · Web enabled data archive software

 · Advanced image analysis software

Warranty and training

 · 1 year warranty

 · Choice of service maintenance contracts

 · Choice of operation/application training contracts

Documentation and support

 · Online user guidance

· User operation manual

 · Prepared for RAPID™ (remote diagnostic support)

 · Free access to “FEI for Owners” online resources

* Optional

** Some Beam Chemistries may be available only on the MultiChem or on the Single GIS