31.080.99 其他半导体分立器件 标准查询与下载

23/30479181 DC BS IEC 62047-48 半导体器件 微机电装置 第48部分：利用MEMS流体装置通过光吸收测定溶液浓度的测试方法

BS IEC 62047-48. Semiconductor devices. Micro-electromechanical devices - Part 48. Test method of determining solution concentration by optical absorption using MEMS fluidic device

GSO IEC 62047-40:2023 半导体器件 微机电器件 第40部分：微机电惯性冲击开关阈值试验方法

IEC 62047-40:2021(E) specifies the test conditions and methods of micro-electromechanical inertial shock switch threshold. This document applies to normally open micro-electromechanical inertial shock switch.

Semiconductor devices - Micro-electromechanical devices - Part 40:Test methods of micro-electromechanical inertial shock switch threshold

GSO IEC 62047-41:2023 半导体器件 微机电器件 第41部分：RF MEMS 环行器和隔离器

IEC 62047-41:2021 specifies the terminology, essential ratings and characteristics, and measuring methods of RF (Radio Frequency) MEMS (Micro-Electro-Mechanical Systems) circulators and isolators.

Semiconductor devices - Micro-electromechanical devices - Part 41: RF MEMS circulators and isolators

BS IEC 63150-1:2019 半导体器件 实际振动环境下动能收集装置的测量与评价方法任意随机机械振动

Semiconductor devices. Measurement and evaluation methods of kinetic energy harvesting devices under practical vibration environment - Arbitrary and random mechanical vibrations

BS IEC 60747-5-16:2023 半导体器件-光电器件 发光二极管 基于光电流谱的GaN基发光二极管平带电压测试方法

Semiconductor devices - Optoelectronic devices. Light emitting diodes. Test method of the flat-band voltage of GaN-based light emitting diodes based on the photocurrent spectroscopy

23/30454374 DC BS EN IEC 62047-47 半导体器件 微机电器件 第 47 部分 硅基 MEMS 制造技术 微结构抗弯强度的测量方法

BS EN IEC 62047-47. Semiconductor devices. Micro-electromechanical devices - Part 47. Silicon based MEMS fabrication technology. Measurement method of bending strength of microstructures

23/30454366 DC BS EN IEC 62047-45 半导体器件 微机电器件 第 45 部分 硅基 MEMS 制造技术 纳米结构抗冲击性的测量方法

BS EN IEC 62047-45. Semiconductor devices. Micro-electromechanical devices - Part 45. Silicon based MEMS fabrication technology. Measurement method of impact resistance of nanostructures

23/30454370 DC BS EN IEC 62047-46 半导体器件 微机电器件 第 46 部分 硅基 MEMS 制造技术 纳米级膜拉伸强度的测量方法

BS EN IEC 62047-46. Semiconductor devices. Micro-electromechanical devices - Part 46. Silicon based MEMS fabrication technology. Measurement method of tensile strength of nanoscale membrane

BS IEC 60747-18-5:2023 半导体器件 半导体生物传感器 通过光入射角评估无透镜CMOS光子阵列传感器封装模块的光响应特性的方法

Semiconductor devices - Semiconductor bio sensors. Evaluation method for light responsivity characteristics of lens-free CMOS photonic array sensor package modules by incident angle of light

IEC 60747-5-16:2023 半导体器件.第5-16部分:光电子器件.发光二极管.基于光电流光谱的GaN基发光二极管的平带电压的试验方法

Semiconductor devices - Part 5-16: Optoelectronic devices - Light emitting diodes - Test method of the flat-band voltage of GaN-based light emitting diodes based on the photocurrent spectroscopy

IEC 60747-18-4:2023 半导体器件.第18-4部分:半导体生物传感器.无透镜CMOS光子阵列传感器噪声特性的评估方法

Semiconductor devices - Part 18-4: Semiconductor bio sensors - Evaluation method of noise characteristics of lens-free CMOS photonic array sensors

IEC 60747-18-5:2023 半导体器件.第18-5部分:半导体生物传感器.通过光入射角对无透镜CMOS光子阵列传感器封装模块的光响应特性的评估方法

Semiconductor devices - Part 18-5: Semiconductor bio sensors - Evaluation method for light responsivity characteristics of lens-free CMOS photonic array sensor package modules by incident angle of lig

IEC 62951-8:2023 半导体器件.柔性和可拉伸半导体器件.第8部分:柔性电阻存储器的可拉伸性、柔性和稳定性的试验方法

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 8: Test method for stretchability, flexibility, and stability of flexible resistive memory

DB35/T 2107-2022 紫外发光二极管测评方法

本文件规定了紫外发光二极管光谱辐射分布和光谱辐射照度测评的操作要求和操作步骤。 本文件适用于测评紫外线辐射峰值波长200 nm～410 nm的发光二极管。

Ultraviolet light-emitting diode evaluation method

IEC 62951-9:2022 半导体器件 柔性可伸缩半导体器件 第9部分：一晶体管一电阻（1T1R）电阻式存储单元的性能测试方法

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 9: Performance testing methods of one transistor and one resistor (1T1R) resistive memory cells

IEC 63364-1:2022 半导体器件物联网系统用半导体器件第1部分：声音变化检测的试验方法

Semiconductor devices - Semiconductor devices for IoT system - Part 1: Test method of sound variation detection

KS C 6565-2022 半导体加速度传感器试验方法

Test methods of semiconductor acceleration sensors

IEC 60747-16-7:2022 半导体器件.第16-7部分:微波集成电路.衰减器

Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators

IEC 60747-16-8:2022 半导体器件.第16-8部分:微波集成电路.限制器

Semiconductor devices - Part 16-8: Microwave integrated circuits - Limiters

KS C IEC 62951-1-2022 半导体器件.柔性和可拉伸半导体器件.第1部分:柔性衬底上导电薄膜的弯曲试验方法

Semiconductor devices — Flexible and stretchable semiconductor devices — Part 1: Bending test method for conductive thin films on flexible substrates