31.080.99 其他半导体分立器件 标准查询与下载

21/30440970 DC BS EN IEC 60747-5-16 半导体器件 第 5-16 部分 光电器件 发光二极管 基于光电流谱的平带电压测试方法

BS EN IEC 60747-5-16. Semiconductor devices - Part 5-16. Optoelectronic devices. Light emitting diodes. Test method of the flat-band voltage based on the photocurrent spectroscopy

BS IEC 62830-8:2021 半导体器件 用于能量收集和发电的半导体器件 低功率电子产品用柔性和可拉伸超级电容器的测试和评估方法

Semiconductor devices. Semiconductor devices for energy harvesting and generation. Test and evaluation methods of flexible and stretchable supercapacitors for use in low power electronics

OVE EN IEC 60747-17:2021 半导体设备 第17部分：用于基本和加强绝缘的磁性和电容耦合器（（IEC 60747-17:2020）EN IEC 60747-17:2020）（德文版）

Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation ((IEC 60747-17:2020) EN IEC 60747-17:2020) (german version)

DS/EN IEC 63244-1:2021 半导体器件《无线电力传输和充电用半导体器件》第1部分：一般要求和规范

Semiconductor devices – Semiconductor devices for wireless power transfer and charging – Part 1: General requirements and specifications

EN IEC 63244-1:2021 半导体设备 用于无线电力传输和充电的半导体设备 第1部分：一般要求和规范

IEC 63244-1:2021 provides general requirements and specifications of the semiconductor devices for the performance and reliability evaluations of wireless power transfer and charging systems. For the performance evaluations, this part covers various characterization parameters and symbols, general system diagrams, and test setups and test conditions. This document also describes classifications of the wireless power transfer technologies.

Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications

IEC TR 60747-5-12:2021 半导体器件第5-12部分:光电子器件发光二极管LED效率的试验方法

Semiconductor devices - Part 5-12: Optoelectronic devices - Light emitting diodes - Test method of LED efficiencies

OVE EN IEC 60747-16-6:2021 半导体器件 第 16-6 部分：微波集成电路 倍频器（（IEC 60747-16-6:2019）EN IEC 60747-16-6:2019）（德文版）

Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers ((IEC 60747-16-6:2019) EN IEC 60747-16-6:2019) (german version)

OVE EN 60747-16-5-2021 半导体器件 第 16-5 部分：微波集成电路 振荡器（德文版）

Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators (german version)

KS C IEC 62047-22-2021 半导体器件 微机电器件 第18部分：薄膜材料弯曲试验方法

Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials

KS C 6562-2021 半导体压力传感器元件的基本额定值和特性

Essential ratings and characteristics for semiconductor pressure sensor elements

KS C 6563-2021 半导体压力传感器元件的主要测量方法

Principal measuring methods for semiconductor pressure sensor elements

KS C IEC 62047-18-2021 半导体器件 微机电器件 第18部分：薄膜材料弯曲试验方法

Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials

BS IEC 62047-40:2021 半导体器件 微机电设备 微机电惯性冲击开关阈值测试方法

Semiconductor devices. Micro-electromechanical devices. Test methods of micro-electromechanical inertial shock switch threshold

21/30436870 DC BS IEC 60747-16-9 半导体器件 第 16-9 部分 微波集成电路 移相器

BS IEC 60747-16-9. Semiconductor devices - Part 16-9. Microwave integrated circuits. Phase shifters

IEC 62047-40:2021 半导体器件微机电装置第40部分：微机电惯性冲击开关阈值测试方法

This part of IEC 62047 specifies the test conditions and methods of micro-electromechanical inertial shock switch threshold. This document applies to normally open micro- electromechanical inertial shock switch.

Semiconductor devices - Micro-electromechanical devices - Part 40: Test methods of micro-electromechanical inertial shock switch threshold

DIN EN IEC 60747-16-6:2021 半导体器件 第 16-6 部分：微波集成电路 倍频器（IEC 60747-16-6:2019）；德文版 EN IEC 60747-16-6:2019

This part of IEC 60747 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit frequency multipliers.

Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers (IEC 60747-16-6:2019); German version EN IEC 60747-16-6:2019

DIN EN 60747-16-5:2021 半导体器件 第 16-5 部分：微波集成电路 振荡器（IEC 60747-16-5:2013 + A1:2020 + COR1:2020）；德文版 EN 60747-16-5:2013 + A1:2020

This part of IEC 60747 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit oscillators. This standard is applicable to the fixed and voltage-controlled semiconductor microwave oscillator devices, except the oscil

Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators (IEC 60747-16-5:2013 + A1:2020 + COR1:2020); German version EN 60747-16-5:2013 + A1:2020

BS IEC 62047-38:2021 半导体器件 微机电设备 微机电互连中金属粉末浆料粘合强度的测试方法

Semiconductor devices. Micro-electromechanical devices. Test method for adhesion strength of metal powder paste in MEMS interconnection

IEC 60747-5-6:2021 RLV 半导体器件第5-6部分:光电子器件发光二极管

Semiconductor devices - Part 5-6: Optoelectronic devices - Light emitting diodes

BS PD IEC TS 60747-19-2:2021 半导体器件 智能传感器 指示用于驱动低功率操作的智能传感器的传感器和电源的规格

Semiconductor devices. Smart sensors. Indication of specifications of sensors and power supplies to drive smart sensors for low power operation