31.080.99 其他半导体分立器件 标准查询与下载
共找到 491 条与 其他半导体分立器件 相关的标准，共 33 页
IEC/PAS 60747-17:2011(E) gives the terminology, essential ratings, characteristics, safety test and the measuring methods of magnetic and capacitive couplers. It specifies the principles of magnetic and capacitive coupling across an isolation barrier and the related requirements for basic isolation and reinforced insulation.
Semiconductor devices - Discrete devices - Part 17: Magnetic and capacitive coupler for basic and reinforced isolation
- ICS
- 31.080.99
- CCS
- 发布
- 2021-07-01
- 实施
Semiconductor devices. Micro-electromechanical devices. RF MEMS circulators and isolators
- ICS
- 31.080.99
- CCS
- 发布
- 2021-06-28
- 实施
- 2021-06-28
Semiconductor devices. Optoelectronic devices. Hydrogen sulphide corrosion test for LED packages
- ICS
- 31.080.99
- CCS
- 发布
- 2021-06-28
- 实施
- 2021-06-28
Semiconductor devices - Micro-electromechanical devices - Part 41: RF MEMS circulators and isolators
- ICS
- 31.080.99
- CCS
- 发布
- 2021-06-15
- 实施
This part of IEC 62047 specifies a test method for measuring the adhesion strength of metal powder paste in the electrical interconnection between micro-electromechanical systems (MEMS) and a circuit board. The typical examples of metal powder paste are anisotropic conductive pas
Semiconductor devices - Micro-electromechanical devices - Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection
- ICS
- 31.080.99
- CCS
- 发布
- 2021-06-01
- 实施
This part of IEC 60747 provides a guideline of indication of specifications of a low-power sensor being a device or a module allowing autonomous power supply operation, which contributes to the low-power design of a smart sensing unit. Here, the smart sensing unit comprises a sma
Semiconductor devices - Part 19-2: Smart sensors - Indication of specifications of sensors and power supplies to drive smart sensors for low power operation
- ICS
- 31.080.99
- CCS
- 发布
- 2021-05-21
- 实施
Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation (IEC 60747-17:2020/COR1:2021)
- ICS
- 31.080.99
- CCS
- 发布
- 2021-04-30
- 实施
- 2021-04-30
What is BS IEC 62047 ‑ 35 - MEMS bending deformation testing about? In the recent trend toward ubiquitous sensor society and the world of internet of things, demand for softer electronic devices is quickly expanding. That is what flexible micro-electromechanical devices are for. To operate such devices, the reliability of the individual devices is a critical concern. Especially in the case of flexible devices, robustness against bending deformation is an important issue which is shared among all the producers and users of such devices. BS IEC 62047 ‑ 35 is part of the IEC 62047 series on microelectromechanical devices. BS IEC 62047 ‑ 35 specifies the test method of electrical characteristics under bending deformation for flexible electromechanical devices. These devices include passive micro components and/or active micro components on the flexible film or embedded in the flexible film.
Semiconductor devices. Micro-electromechanical devices - Test method of electrical characteristics under bending deformation for flexible electromechanical devices
- ICS
- 31.080.99
- CCS
- 发布
- 2021-04-30
- 实施
- 2021-04-30
Semiconductor devices--Part 16-5: Microwave integrated circuits--Oscillators (IEC 60747-16-5:2013/A1:2020 + COR1:2020)
- ICS
- 31.080.99
- CCS
- 发布
- 2021-04-13
- 实施
- 2021-04-13
Semiconductor devices - Classification of defects in gallium nitride epitaxial film on silicon carbide substrate
- ICS
- 31.080.99
- CCS
- 发布
- 2021-04-07
- 实施
Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 7: Linear sliding mode triboelectric energy harvesting
- ICS
- 31.080.99
- CCS
- 发布
- 2021-03-03
- 实施
Wearable electronic devices and technologies - Part 406-1: Test method for measuring surface temperature of wrist worn wearable electronic devices while in contact with human skin (IEC 124/125/CDV) (english version)
- ICS
- 31.080.99
- CCS
- 发布
- 2021-03-01
- 实施
- 2021-03-01
本文件规定了三相桥式整流模块的术语和定义、产品分类、基本要求、技术要求、试验方法、检验规则、标志、包装、运输、贮存和质量承诺。 本文件适用于由六个整流管管芯组成，按壳温额定MDS30～MDS300型三相桥式整流模块(以下简称模块)。
Three-phase bridge rectifier module
- ICS
- 31.080.99
- CCS
- C397
- 发布
- 2021-03-01
- 实施
- 2021-05-18
Semiconductor devices – Part 17: Magnetic and capacitive coupler for basic and reinforced insulation
- ICS
- 31.080.99
- CCS
- 发布
- 2021-02-17
- 实施
- 2021-02-17
This part of IEC 62830 specifies the test method for measuring generated electric power from flexible thermoelectric devices under bending conditions. This document provides terms, definitions, symbols, configurations, and test methods that can be used to evaluate and determine t
Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 5: Test method for measuring generated power from flexible thermoelectric devices
- ICS
- 31.080.99
- CCS
- 发布
- 2021-01-21
- 实施
Corrigendum 1 - Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation
- ICS
- 31.080.99
- CCS
- 发布
- 2021-01-19
- 实施
Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation (IEC 60747-17:2020)
- ICS
- 31.080.99
- CCS
- 发布
- 2021-01-15
- 实施
- 2021-01-15
Semiconductor die products - Part 8: EXPRESS model schema for data exchange
- ICS
- 31.080.99
- CCS
- L70
- 发布
- 2021
- 实施
Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
- ICS
- 31.080.99
- CCS
- B40/49
- 发布
- 2021
- 实施
Semiconductor die products - Part 4: Questionnaire for die users and suppliers
- ICS
- 31.080.99
- CCS
- J40/49
- 发布
- 2021
- 实施
