31.080.99 其他半导体分立器件 标准查询与下载



共找到 491 条与 其他半导体分立器件 相关的标准,共 33

Semiconductor die products - Part 1: Procurement and use

ICS
31.080.99
CCS
J40/49
发布
2021
实施

Semiconductor die products - Part 5: Requirements for information concerning electrical simulation

ICS
31.080.99
CCS
L70
发布
2021
实施

Semiconductor die products - Part 7: XML schema for data exchange

ICS
31.080.99
CCS
J40/49
发布
2021
实施

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 6: Test and evaluation methods for vertical contact mode triboelectric energy harvesting devices

ICS
31.080.99
CCS
K46
发布
2021
实施

Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices

ICS
31.080.99
CCS
L55/59
发布
2021
实施

Semiconductor die products - Part 8: EXPRESS model schema for data exchange

ICS
31.080.99
CCS
L70
发布
2021
实施

Semiconductor devices - Bias-temperature stability test for metal-ox ide, semiconductor, field-effect transistors (MOSFET) - Part 1: Fast BTI test for MOSFET

ICS
31.080.99
CCS
L40/49
发布
2021
实施

Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage

ICS
31.080.99
CCS
B40/49
发布
2021
实施

Discrete semiconductor devices and integrated circuits —Part 5-2: Optoelectronic devices — Essential ratings and characteristics

ICS
31.080.99
CCS
发布
2020-12-24
实施

Discrete semiconductor devices and integrated circuits —Part 5-2: Optoelectronic devices — Essential ratings and characteristics

ICS
31.080.99
CCS
发布
2020-12-24
实施

Discrete semiconductor devices and integrated circuits —Part 5-3: Optoelectronic devices — Measuring methods

ICS
31.080.99
CCS
发布
2020-12-24
实施

Discrete semiconductor devices and integrated circuits —Part 5-3: Optoelectronic devices — Measuring methods

ICS
31.080.99
CCS
发布
2020-12-24
实施

Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators (IEC 60747-16-5:2013/A1:2020)

ICS
31.080.99
CCS
发布
2020-11-30
实施
2020-11-30

Semiconductor devices ― Micro-electromechanical devices ― Part 8: Strip bending test method for tensile property measurement of thin films

ICS
31.080.99
CCS
发布
20201120
实施
20201120

Semiconductor devices - MEMS devices - Part 5: RF MEMS switches

ICS
31.080.99
CCS
发布
20201120
实施
20201120

Semiconductor devices – Part 17: Magnetic and capacitive coupler for basic and reinforced insulation

ICS
31.080.99
CCS
发布
2020-11-11
实施
2020-11-11

Semiconductor devices. Magnetic and capacitive coupler for basic and reinforced insulation

ICS
31.080.99
CCS
L40
发布
2020-11-10
实施
2020-11-10

Domaine d'applicationLa présente partie de l'IEC 60747 spécifie la terminologie, les valeurs assignées essentielles, les caractéristiques, l'essai de sécurité et les méthodes de mesure des coupleurs magnétiques et des coupleurs capacitifs.Elle spécifie les principes et exigences

Semiconductor devices - Part 17 : magnetic and capacitive coupler for basic and reinforced insulation

ICS
31.080.99
CCS
发布
2020-11-06
实施
2020-12-18

What is BS EN 60747-16-5 about?    BS EN 60747 series covers semiconductor devices. BS EN 60747-16-5 is one of the parts of the documents that specify the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit oscillators.    BS EN 60747-16-5 is applicable to the fixed and voltage-controlled semiconductor microwave oscillator devices, except the oscillator modules such as synthesizers which require external controllers.   Note: BS EN 60747-16-5 is not applicable to the quartz crystal-controlled oscillators. They are specified by IEC 60679-1 .  Who is BS EN 60747-16-5 for?

Semiconductor devices - Microwave integrated circuits. Oscillators

ICS
31.080.99
CCS
发布
2020-09-30
实施
2020-09-30

Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation

ICS
31.080.99
CCS
发布
2020-09-21
实施



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