31.080.99 其他半导体分立器件 标准查询与下载

EN 60747-16-5:2013/A1:2020 半导体器件 第 16-5 部分：微波集成电路 振荡器

The contents of the corrigendum of September 2020 have been included in this copy.

Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators

BS IEC 62830-1:2017 半导体器件 用于能量收集和生成的半导体器件 基于振动的压电能量收集

What is BS IEC 62830-1 - Vibration-based piezoelectric energy harvesting about?     BS IEC 62830-1 is an international standard that discusses semiconductor devices for energy harvesting and generation.   BS IEC 62830-1 is the first part of the series that defines terms, definitions, symbols, configurations, and test methods that can be used to evaluate and determine the performance characteristics of vibration-based piezoelectric energy harvesting devices for practical use.    BS IEC 62830-1 is applicable to energy harvesting devices for consumers, general industries, military, and aerospace applications without any limitat...

Semiconductor devices. Semiconductor devices for energy harvesting and generation - Vibration based piezoelectric energy harvesting

BS IEC 62047-27:2017 半导体器件 微机电设备 使用微 V 形测试 (MCT) 进行玻璃熔块粘合结构的粘合强度测试

What is BS IEC 62047 ‑ 27 - Micro-chevron-tests (MCT) for semiconductor devices about?      BS IEC 62047 is an international standard that discusses semiconductor devices including microelectromechanical devices. The main aim of the IEC 62047 series is to provide entities involved with semiconductor technology with best industry techniques to demonstrate the reliability and performance of their devices and components.   BS IEC 62047 ‑ 27 specifies a method for assessing the bond strength of glass frit bonded structures ...

Semiconductor devices. Micro-electromechanical devices - Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

BS IEC 62047-28:2017 半导体器件 微机电器件 振动驱动MEMS驻极体能量收集器件性能测试方法

What is BS IEC 62047 ‑ 28 - Vibration-driven MEMS for energy harvesting devices ?      BS IEC 62047 is an international standard that discusses semiconductor devices including microelectromechanical devices. The main aim of the IEC 62047 series is to provide entities involved with semiconductor technology with best industry techniques to demonstrate the reliability and performance of their devices and components.   BS IEC 62047 ‑ 28 is the 28 th

Semiconductor devices. Micro-electromechanical devices - Performance testing method of vibration-driven MEMS electret energy harvesting devices

IEC 60747-16-5:2013/AMD1:2020 修改件1.半导体器件.第16-5部分:微波集成电路.振荡器

Amendment 1 - Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators

IEC 60747-16-5:2013+AMD1:2020 CSV 半导体器件第16-5部分:微波集成电路振荡器

Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators

IEC 63068-3:2020 半导体器件.功率器件用碳化硅同质外延片中缺陷的无损识别标准.第3部分:用光致发光法检测缺陷的试验方法

Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 3: Test method for defects using photoluminescence

IEC 62384:2020 LED模块用直流或交流电子控制设备.性能要求

DC or AC supplied electronic controlgear for LED modules - Performance requirements

IEC 62384:2020 RLV LED模块用直流或交流电子控制设备.性能要求

DC or AC supplied electronic controlgear for LED modules - Performance requirements

IEC 60747-18-3:2019 半导体器件.第18-3部分:半导体生物传感器.带射流系统的无透镜CMOS光子阵列传感器组件的流体流动特性

Semiconductor devices - Part 18-3: Semiconductor bio sensors - Fluid flow characteristics of lens-free CMOS photonic array sensor package modules with fluidic system

IEC 60747-5-9:2019 半导体器件第5-9部分:光电子器件发光二极管基于温度依赖性电致发光的内部量子效率试验方法

Semiconductor devices - Part 5-9: Optoelectronic devices - Light emitting diodes - Test method of the internal quantum efficiency based on the temperature-dependent electroluminescence

IEC 60747-5-10:2019 半导体器件第5-10部分:光电子器件发光二极管基于室温基准点的内部量子效率试验方法

Semiconductor devices - Part 5-10: Optoelectronic devices - Light emitting diodes - Test method of the internal quantum efficiency based on the room-temperature reference point

IEC 60747-5-11:2019 半导体器件第5-11部分:光电子器件发光二极管发光二极管辐射电流和非辐射电流的试验方法

Semiconductor devices - Part 5-11: Optoelectronic devices - Light emitting diodes - Test method of radiative and nonradiative currents of light emitting diodes

IEC 60747-19-1:2019 半导体器件第19-1部分:智能传感器智能传感器控制方案

Semiconductor devices – Part 19-1: Smart sensors – Control scheme of smart sensors

IEC 62047-35:2019 半导体器件.微机电装置.第35部分:挠性机电装置弯曲变形电特性的试验方法

Semiconductor devices – Micro-electromechanical devices - Part 35: Test method of electrical characteristics under bending deformation for flexible electro-mechanical devices

IEC 60747-5-8:2019 半导体器件第5-8部分:光电子器件发光二极管发光二极管光电效率试验方法

Semiconductor devices - Part 5-8: Optoelectronic devices - Light emitting diodes - Test method of optoelectronic efficiencies of light emitting diodes

IEC 60050-523:2018/AMD1:2019 修改件1.国际电工词汇（IEV）.第523部分:微机电系统（MEMS）

Amendment 1 - International Electrotechnical Vocabulary (IEV) - Part 523: Micro-electromechanical systems (MEMS)

EN IEC 60747-16-6:2019 半导体器件 第 16-6 部分：微波集成电路 倍频器

IEC 6074716-6:2019 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit frequency multipliers.

Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers

IEC 62830-6:2019 半导体器件.能量收集和产生用半导体器件.第6部分:垂直接触式摩擦电能收集器件的试验和评定方法

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 6: Test and evaluation methods for vertical contact mode triboelectric energy harvesting devices

IEC 60747-16-6:2019 半导体器件第16-6部分:微波集成电路倍频器

Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers