一万次的1,000,000,000次方等于多少 标准查询与下载
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Statistical interpretation of interlaboratory tests. Simplified method applicable to maximum 20 laboratories and maximum 10 results per laboratory.
This sectionai specification is applicable to circular multicontact connectors of assessed quality for use in direct current and low frequency analog
Sectional Specification for Circular Multicontact Connectors of Assessed Quality (for Frequencies Essentially Below 3 MHz)
Sectional Specification for Class la Multimode Graded-Index Optical Waveguide Fibers
Detail Specification for Electronic Components Fixed Multilayer Ceramic Chip Capacitors Assessment Level E
This sectional specification was formulated for the purpose of providing a document setting forth engineering requirements, quality requirements
Sectional Specification for Circular Multicontact Connectors of Assessed Quality (for Frequencies Essentially Below 3 MHz)
(This Foreword is informative only and is not part of this Standard.) This document comes from TIA Standards Proposal No. 3001-8, formulated under
Sectional Specification for Class Ia Graded-Index Multimode Optical Fibers
This Sectional Specification relates to the sockets for chip carriers of assessed quality. The purpose of this Specification is to provide a means
Sectional Specification for Sockets for Chip Carriers for Use in Electronic Equipment
Die vorliegende Norm legt die Sicherheitsfarben so-wie die Form und Darstellung der Sicherheitszeichen fest, die zur Verhütung von Unf?llen und
Tapered long shaft ends for machines and instruments
This standard applies to fixed chip capacitors for direct current, with metallized electrodes and polyethyleneterephthalate dielectric for use
Sectional Specification for Fixed Chip Capacitors with Metallized Electrodes and Polyethylene-Terephthalate Dielectric for Use in Electronic Equipment
Council directive concerning electrical equipment for use in potentially explosive atmospheres.
This Sectional Specification relates to the sockets for Multi-Package Modules of assessed qualtty. The purpose of this Specification is to provide
Sectional Specification for Multi-Package Module Sockets for Use in Electronic Equipment
This sectional specification relates to the burn-in sockets for Ball Grid Array (BGA) devices of assessed quality. The purpose of this specification
Sectional Specification for Burn-In Sockets Used with Ball Grid Array Devices for Use in Electronic Equipment
La presente norma tiene por objeto establecer las condiciones técnicas de suministro e inspección de loscables de cordones empleados en las
Cables for extraction devices in mines. General technical conditions for supply and inspection of thick cables
Sectional Specification for a Field Portable Optical Microscope for Inspection of Optical Waveguides and Related Devices
This sectional specification relates to the sockets for Pin Grid Array devices of assessed quality. The purpose of this specification is to provide
"Sectional Specification Sockets for Pin Grid Array Devices With 2.54 mm x 2.54 mm (0.1"" x 0.1"") Spacing for Use in Electronic Equipment"
