L93 电子设备用金属件 标准查询与下载

DIN EN 62739-2:2017 使用熔融无铅焊料合金的波峰焊接设备腐蚀的试验方法.第2部分:表面处理金属材料的腐蚀试验方法(IEC 62739-2-2016);德文版本EN 62739-2-2016

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing (IEC 62739-2:2016); German version EN 62739-2:2016

BS EN 62739-2:2016 使用熔融无铅焊料合金的波峰焊接设备腐蚀的试验方法. 表面处理金属材料的腐蚀试验方法

Test method for erosion of wave soldering equipment using molten lead-free solder alloy. Erosion test method for metal materials with surface processing

JIS C 0806-3:2014 自动处理用元件的包装.第3部分:连续传送带上表面装配元件的包装

Packaging of components for automatic handling -- Part 3: Packaging of surface mount components on continuous tapes

DIN EN 61969-3:2012 电子设备的机械结构.户外机壳.第3部分:环境要求,测试和安全性方面(IEC 61969-3-2011).德文版本EN 61969-3-2012

Mechanical structures for electronic equipment - Outdoor enclosures - Part 3: Environmental requirements, tests and safety aspects (IEC 61969-3:2011); German version EN 61969-3:2012

SJ 20813-2002 铝和铝合金化学转化膜规范

Specification for chemical conversion on aluminum and aluminum alloys

JEDEC JEP139-2000 老化应力松弛特征化铝互连线金属喷镀

Stress-induced voiding, which can occur during processing, storage, and use, is a reliability concern for microelectronics chips that use Al-based alloys for on-chip wiring. The subject has been extensively reviewed by Okabayashi [ 3 ] . Susceptible metallizations can grow voids in lines and under or over W studs. For simple metallizations like AlSi, such voids can cause catastrophic failure. For metallizations of Al layered with a refractory shunt layer, voids cause resistance increases and interact with other failure mechanisms, such as electromigration and mechanical failure, to shorten lifetime.

Constant Temperature Aging to Characterize Aluminum Interconnect Metallization for Stress-Induced Voiding

NAVY MIL-PRF-85726 B-1998 强迫风冷标准航空电子设备的机壳的规定

This specification covers forced air-cooled standard avionics enclosures, hereinafter referred to as enclosures. The enclosures accommodate Standard Electronic Modules (SEMS) Format B Span 2, Format C, and Format E, and a standard backplane.

ENCLOSURE, STANDARD AVIONICS, FORCED AIR-COOLED, SPECIFICATION FOR

NAVY MIL-PRF-85725 A-1998 强迫风冷综合航空电子设备的机架的一般规定

This specification covers forced-air-cooled, integrated avionics racks, herein after referred to as racks, used for various military avionics systems.

RACK, INTEGRATED AVIONICS, FORCED AIR COOLED, GENERAL SPECIFICATION FOR

NAVY MIL-C-81777 B NOTICE 1-1997 HD-908( )/AWM-23(V)型液体冷却装置电子设备

MIL-C-8 1777B(AS) is inactive for new design and is no longer used, except for replacement purposes.

COOLER, LIQUID, ELECTRONIC EQUIPMENT HD-908( )/AWM-23(V)

NAVY MIL-C-81952 B NOTICE 1-1997 HD-957( ) /AWM-23(V)型液体冷却装置电子设备

This notice should be filed in front of MIL-C-8 1952B(AS), dated 1 1 July 1977.

COOLER, LIQUID, ELECTRONIC EQUIPMENT HD-957( ) /AWM-23(V)

NAVY MIL-C-85441 NOTICE 1-1996 CY-7887/UPQ-5型电子设备盒

This notice should be filed in front of MiL-C-85441(AS), dated 22 December 1980, and Amendment 1, dated 15 February 1985.

CABINET, ELECTRICAL EQUIPMENT CY-7887/UPQ-5

NAVY MIL-H-15362 B NOTICE 2-1996 航空电子设备试验台吊带吊带

This notice should be filed in front of MIL-H-l5362B(AER), dated 15 September 1958, and Notice 1, dated 21 March 1988.

HARNESSES; TEST BENCH, AVIONIC EQUIPMENT GENERAL SPECIFICATION FOR

NAVY MS91405 REV E NOTICE 1-1996 小型支承座(用于飞机电子设备)

BASES, MOUNTING, LARGE-SIZE (FOR USE WITH ELECTRONIC EQUIPMENT IN AIRCRAFT)

BASES, MOUNTING, LARGE-SIZE (FOR USE WITH ELECTRONIC EQUIPMENT IN AIRCRAFT)

NAVY MS91404 REV D NOTICE 1-1996 小型支承座(用于飞机电子设备)

This notice should be filed in front of MS91404D, dated 20 October 1966,

BASES, MOUNTING, SMALL-SIZE (FOR USE WITH ELECTRONIC EQUIPMENT IN AIRCRAFT)

SJ/T 10726-1996 冲压件一般检验原则

本标准规定了冲压生产中对在线制品和入库产品的一般检验原则。 本标准适用于金属材料冲压件。非金属材料冲压件可参照执行。

General inspection principles of stampings

NAVY MIL-HDBK-5400-1995 机载一般准则电子设备

This handbook contains general guidelines fOr .SleCtrOniC” equipment for operation in piloted aircraft and helicopters, missiles, boosters and al1ied vehicles. Oetail electrical and mechanical design, performance and test requirements should be as specified in the det’ail specification or contract. This handbook is for guidance only. This handbook cannot be cited as a requirement.

ELECTRONIC EQUIPMENT, AIRBORNE GENERAL GUIDELINES FOR

NAVY MIL-C-81777 B (1)-1995 HD-908( )/AWM-23(V)型液体冷却装置电子设备

This amendment forms a part of MIL-C-81777B(AS), dated 30 November 1973,and is approved for use by the Naval Air Systems Command, Department of the Navy, and is available for use by all Departments and Agencies of the Department of Defense.

COOLER, LIQUID, ELECTRONIC EQUIPMENT HD-908( )/AWM-23(V)

SJ 20390-1993 电子器件用玻璃.金属接头规范

Specification for glass-to-metal headers used in electron devices

NAVY MIL-E-5400 T NOTICE 1-1992 航天航空电子设备的一般规格

This notice should be filed in front of MIL-E-5400T(3) dated 14 May 1990.

ELECTRONIC EQUIPMENT, AEROSPACE, GENERAL SPECIFICATION FOR

NAVY MIL-STD-2218-1992 机载电子设备散热设计,分析和测试程序

This standard establishes requirements for thermal design and cool ing analyses, thermal design verification tests, and preproduction qualification tests for airborne electronic equipment.

THERMAL DESIGN, ANALYSIS, AND TEST PROCEDURES FOR AIRBORNE ELECTRONIC EQUIPMENT