31.190;31.240 标准查询与下载

BS EN 62739-3:2017 使用熔融无铅焊料合金的波峰焊设备侵蚀试验方法. 第3部分: 侵蚀试验方法选择指南

Test method for erosion of wave soldering equipment using molten lead-free solder alloy. - Part 3: Selection guidance of erosion test methods

BS EN 62739-2:2016 使用熔融无铅焊料合金的波峰焊接设备腐蚀的试验方法. 表面处理金属材料的腐蚀试验方法

Test method for erosion of wave soldering equipment using molten lead-free solder alloy. Erosion test method for metal materials with surface processing

JIS C 61191-1:2015 印刷电路板组件.第1部分:一般规范.使用表面安装和相关装配技术的焊接电气组件和电子组件的要求

Printed board assemblies -- Part 1: Generic specification -- Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

JIS C 61191-2:2015 印刷电路板组件.第2部分:分规范.表面安装焊接组件的要求

Printed board assemblies -- Part 2: Sectional specification -- Requirements for surface mount soldered assemblies

JIS C 62739-1:2015 使用熔融无铅焊料合金的波峰焊设备腐蚀的试验方法. 第1部分: 未经表面处理的金属材料的腐蚀试验方法

Test method for erosion of wave soldering equipment using molten lead-free solder alloy -- Part 1: Erosion test method for metal materials without surface processing

DS/EN 61191-2:2013 印制板组件 第2部分：分规范 表面安装焊接组件的要求

IEC 61191-2:2013 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

DS/EN 61191-1:2013 印制板组件 第1部分：通用规范 使用表面贴装和相关组装技术的焊接电气和电子组件的要求

IEC 61191-1:2013 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. It also includes recommendations for good manuf

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

DS/EN 62739-1:2013 使用熔融无铅焊料合金的波峰焊设备侵蚀试验方法 第1部分：未进行表面处理的金属材料侵蚀试验方法

IEC 62739-1:2013 provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing

IEC 61587-1:1999 电子设备用机械构件 IEC 60917和IEC 60297的试验 第1部分:机箱、构柜、分机柜和机架的气候试验、机械试验和安全性能

This part of IEC 61587 specifies mechanical tests, climatic tests and safety aspects for cabinets, racks, subracks and chassis as defined in the detail standards of IEC 60917 and IEC 60297 for indoor and outdoor applications. It applies in whole or part only to the mechanical structures for electronic equipment practices according to IEC 60297 and IEC 60917 and does not apply to electronic equipment or systems. The object of this standard is to ensure physical integrity and environmental performance in cabinets, racks, subracks and chassis, taking into account the need for different levels of performance in different applications. It is intended to give the user a level of confidence in the selection of an equipment practice to meet his specific needs.

Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 1: Climatic, mechanical tests and safety aspects for cabinets, racks, subracks and chassis