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GEMINI®FB
GEMINI®FB  自动化集体晶圆对晶圆接合系统GEMINI® FB   Automated Co......
EVG320
EVG320 D2W  混合键合面激活和清洁系统EVG®320 D2W   Automated Die Preparat......
PICOSUN原子层沉积系统ALD
PICOSUN原子层沉积系统ALD R-200高级版(PICOSUN™ ALD R-200 Advanced) 名称:原子层沉积系统  &n......
PICOSUN原子层沉积系统ALD
PICOSUN原子层沉积系统ALD R-200 Pro(PICOSUN™ ALD R-200 S Pro)原子层沉积系统( ALD P-20......
PICOSUN原子层沉积系统ALD
PICOSUN原子层沉积系统ALD R-200基础版(PICOSUN™ ALD R-200 Standard) 名称:原子层沉积系统  产地......
GEMINI
GEMINI  FB   Automated Production Wafer Bonding SystemGEMINI......
EVG
EVG 850   Automated Production Bonding System for SOIEVG 850......
EVG
EVG 850 LTAutomated Production Bonding System for SOI and Direct Wafer Bond......
EVG
EVG 810 LT  LowTemp™ Plasma Activation SystemEVG 810LT ......
EVG
EVG 320  Automated Single Wafer Cleaning SystemEVG 320  自动化单......
EVG
EVG 301  Single Wafer Cleaning SystemEVG 301  单晶圆清洗系统 研......
EVG
EVG 6200 BA  Automated Bond Alignment SystemEVG 6200 BA自动键对准......
EVG
EVG 620 BAAutomated Bond Alignment SystemEVG 620BA  自动键对准系统&......
EVG
EVG 610 BA  Bond Alignment SystemEVG 610BA   ......
EVG
EVG 850 DB  Automated Debonding SystemEVG 850DB  自......
EVG
EVG 850 TB  Automated Temporary Bonding SystemEVG 850TB ......
EVG
VG 805  Debonding SystemEVG 805  脱胶系统 薄晶圆脱胶&n......
GEMINI
GEMINI   Automated Production Wafer Bonding SystemGEMINI 自动化......
ComBond
ComBond Automated High-Vacuum Wafer Bonding SystemComBond 自动化的高真空晶圆键合系......
EVG
EVG 560  Automated Wafer Bonding SystemEVG 560  自动......
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