LOAD LOCK Chamber (option)

LOAD LOCK预真空进样室（可选）

Chamber with front open door

前开门蒸发腔体

Cryopump and dry pump

冷凝泵和干泵

Multiple thermal evaporation sources   or OLED sources

多个热阻蒸发源或OLED低温蒸发源

Max. 6” substrate

6”基片

Substrate rotation

基片旋转

Substrate bias (option)

基片偏压（可选）

Ion source for substrate cleaning   (option)

离子源清洗基片（可选）

Substrate heating to 1000C (option)

基片加热1000度(可选)

Crystal rate monitor and film   thickness control

晶振沉积速率及膜厚控制

Manual or automatic system control

系统手动或自动控制

For deposition of metal, semiconductor   and insulation materials

可沉积金属、半导体和绝缘材料

For deposition of multi-layer or alloy   film