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您现在所在的位置:首页 >> 仪器导购 >> 其他包装业专用>> 美国OAI全自动上侧或后侧光刻机6000 FSA

美国OAI全自动上侧或后侧光刻机6000 FSA

tel: 400-6699-117 1000

OAI其他包装业专用, 本产品具有卓越的工艺重复性,6000系列是所有生产环境的完美解决方案。......

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规格

 

曝光系统
曝光模式真空接触硬接触软接触接近(2μ间隙)
高级光束
均匀梁尺寸:50mm - 200mm方形/圆
200mm-300mm见方/圆
均匀度:优于±3%
相机:双摄像头与CCTV扩展的景深


对齐系统


模式识别CognexvisionPro1™与OAI定制软件
对准精度0.5μ顶面
1.0μ,顶部到底部可选背面对齐
预对准精度优于±50μ
自动对齐顶部到底部
顶部


晶片处理


基材尺寸50mm-200mm圆形或方形或200mm-300mm圆形或正方形
薄晶片低至100M
翘曲晶片高达7mm-10mm
厚和粘合基板高达7000μ
机器人单臂和双臂晶片处理
失步补偿标准软件或可选的热卡盘
晶片尺寸转换5分钟以内
吞吐量第一掩模每小时180个晶片 - 随后75-100个晶片每小时
楔形效果平整3点或可选非接触

 

可用选项


IR自动对齐,
盒式磁带映射
365nm LED曝光光源
温度控制晶片卡盘
集成屏蔽管理控制
用于全光刻的集成光刻集群
使用SMIF或FOUP接口模块的过程环境控制
非接触式调平
边缘夹紧
 

Model 6000 FSA Fully Automated, Topside or Backside Mask Aligner for Production
 
For: Semiconductors, MEMS, Sensors, Microfluidics, IOT, Packaging
With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with a new elite class of production photolithography equipment.

Built on the venerable OAI modular platform, the Series 6000 has topside or backside alignment that is fully automated with sub-micron resolution which delivers performance that is unmatched at any price.

The Aligners have Advanced Beam Optics with better than ±3% uniformity and a throughput of 180 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.

With superb process repeatability, the Series 6000 is the perfect solution for all production enviroments. Choose either top side or optional back side alignment which uses OAI's customized pattern recognition software that is Cognex based. For the total lithography process, the Seriesl 6000 can be integrated seamlessly with cluster tools. OAI's new production mask Aligners are the total package.

BENEFITS


• Fully Automated
• Topside Alignment
• Optional: Bottomside Alignment
• DUV to NUV
• Cluster Tool Integration
• Customized Software
SPECIFICATIONS

Exposure System
Exposure Modes Vacuum contact Hard contact Soft contact Proximity (2μ gap)
Advanced Beam Optics
Uniform Beam Size: 50mm - 200mm square/round
  200mm - 300 mm square/round
Uniformity: Better than ±3%
Camera: Dual Camera with CCTV with Expanded Depth of Field

Alignment System
Pattern Recognition Cognex visionPro1™ with OAI customized software
Alignment Accuracy 0.5μ topside
  1.0μ with top to bottom optional backside alignment
Pre-alignment Accuracy Better than ±50μ
Auto-alignment Top to bottomside

  Topside

Wafer Handling
Substrate size 50mm – 200mm round or square or 200mm-300mm round or square 
Thin wafers Down to 100Μ 
Warped Wafers Up to 7mm-10mm 
Thick & Bonded Substrates Up to 7000μ 
Robotics Single and dual arm wafer handling 
Run-out compensation Standard software or optional thermal chuck 
Wafer size conversion 5 minutes or less 
Throughput 1st mask 180 wafers per hour - subsequent 75-100 wafers per hour 
Wedge Effect Leveling 3 point or optional non-contact 
Available Options


厂家资料

地址:深圳市宝安区沙井街道共和第四工业区昊海弘工业园A6栋7楼

电话:400-6699-117 转 1000

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