Helios G4 FX 属于业界领先的 Helios DualBeam 系列的第四代产品。它经过精心设计,通过提供zei好的一体化 STEM 样品制备和成像解决方案来满足科学家和工程师的需求。Helios G4 FX 将创新的 Elstar 电子镜筒与用于极高分辨率成像和zei高材料对比度的大电流 UC+ 技术,用于亚 3Å 原位低 kV STEM 成像的透镜内 STEM 4,以及卓越的 Phoenix 离子镜筒结合在一起,实现zei快、zei简单、zei精确的高品质样品制备。除了zei先进的电子和离子光学元件,Helios G4 FX 还采用了一套先进的技术,可以进行简单和一致的高分辨率 S/TEM 和原子探针断层扫描 (APT) 样品制备,以及zei高质量的亚表层和三维表征,即使针对zei具挑战性的样品。
Electron optics
· Elstar extreme high-resolution field emission SEM column with:
- Immersion magnetic objective lens
- High-stability Schottky field emission gun to provide stable high-resolution analytical currents
- UC+ monochromator technology
· 60 degree dual objective lens with pole piece protection allows tilting larger samples
· Automated heated apertures to ensure cleanliness and touch free aperture exchange
· Electrostatic scanning for higher deflection linearity and speed
· ConstantPower™ lens technology for higher thermal stability
· Integrated Fast Beam Blanker*
· Beam deceleration with stage bias from 0 V to -4 kV
· Minimum source lifetime: 12 month
Electron beam resolution
· At optimum WD:
- 0.3 nm at 30 kV STEM in-lens mode
- 0.6 nm at 2 kV
- 0.7 nm at 1 kV
- 1.0 nm at 500 V (ICD)
· At coincident point:
- 0.6 nm at 15 kV
- 1.2 nm at 1 kV
Electron beam parameter space
· Electron beam current range: 0.8 pA to 100 nA
· Accelerating voltage range: 200 V – 30 kV
· Landing energy range: 20 eV – 30 keV
· Maximum horizontal field width: 2.3 mm at 4 mm WD
Ion optics
Phoenix ion column with superior high current and low voltage performance
· Ion beam current range: 0.1 pA – 65 nA
· Accelerating voltage range: 500 V – 30 kV
· 2-stage differential pumping
· Time-of-flight (TOF) correction
· 15-position aperture strip
· Maximum horizontal field width: 0.9 mm at beam coincidence point
· Minimum source lifetime: 1,000 hours Ion beam resolution at coincident point
· 4.0 nm at 30 kV using preferred statistical method
· 2.5 nm at 30 kV using selective edge method
Detectors
· Retractable In-Lens STEM 4 detector with BF/ DF/ HAADF segments
· Elstar in-lens SE/BSE detector (TLD-SE, TLD-BSE)
· Elstar in-column SE/BSE detector(ICD)
· Elstar in-column BSE detector (MD)
· Everhart-Thornley SE detector (ETD)
· IR camera for viewing sample/ column
· High performance ion conversion and electron (ICE) detector for secondary ions (SI) and electrons (SE)
· In-chamber Nav-Cam™ sample navigation camera
· Retractable low voltage, high contrast directional solid-state backscatter electron detector (DBS)*
· Integrated beam current measurement
Stage and sample
Ultra high precision 5-axis piezo motorized stage:
· XY range: 100 mm
· Z range: 20 mm
· Rotation: 360° (endless)
· Tilt precision: 0.1° (between 50° and 54°)
· Tilt range: -10° to +60°
· XY repeatability: 0.5 μm
· Max sample weight: 200 g (including sample holder)
· Max sample size: 100 mm with full rotation
· Compucentric rotation and tiltAutomated CompuStage with double-flip holder:
· 5 axis CompuStage with STEM holder, equipped with automated insert/retract mechanism and air lock for fast TEM grid exchange without breaking system vacuum
Vacuum system
· Complete oil-free vacuum system
· Chamber vacuum: < 2.6×10-6 mbar (after 24 h pumping)
· Evacuation time: < 5 minutes
Chamber
· E- and I-beam coincidence point at analytical WD (4 mm SEM)
· Ports: 21
· Inside width: 379 mm
· Integrated plasma cleaner
Sample holders
· Multi-stub holder
· Multi-sample cross-sectional holder*
· Single stub mount, mounts directly onto stage
· Various wafer and custom holder(s) available by request*
Image processor
· Dwell time range from 25 ns – 25 ms/pixel
· Up to 6144 × 4096 pixels
· File type: TIFF (8, 16, 24-bit), BMP or JPEG standard
· SmartSCAN™ (256 frame average or integration, line integration and averaging, interlaced scanning)
· DCFI (Drift Compensated Frame Integration)
System control
· 64-bit GUI with Windows 7, keyboard, optical mouse
· Up to four live images showing independent beams and/or signals. Live color signal mixing
· Local language support: Check with your local FEI Sales representatives for available language packs
· Two 24-inch widescreen monitors (1920×1200 pixels) for system GUI and full-screen image
· Microscope controlling and support computers seamlessly sharing one keyboard, mouse and monitors
· Joystick*
· Multifunctional control panel*
· Remote control and imaging*
Supporting software
· ‘Beam per view’ graphical user interface concept, with up to 4 simultaneously active quads
· FEI SPI™ (simultaneous FIB patterning and SEM imaging), iSPI™ (intermittent SEM imaging and FIB patterning), iRTM™ (integrated real time monitor)
and FIB immersion mode for advanced, real-time SEM and FIB process monitoring and endpointing
· Patterns supported: lines, rectangles, polygons, circles, donut, cross- section and cleaning cross-section
· Directly imported BMP file or stream file for 3D milling and deposition
· Material file support for ‘minimum loop time’, beam tuning and independent overlaps
· Image registration enabling sample navigation in an imported image
· Sample navigation on an optical image
Accessories (standard)
· MultiChem™: up to 6 chemistries on the same unit for advanced etching and deposition controls
· EasyLift™ EX for precise in situ sample manipulation
· Automatic loadlock with sample holder set for fast sample transfer
· Specimen height detection
Accessories (optional)
· GIS (Gas Injection System) – Solutions:
· Single GIS: up to 4 independent units for enhanced etching or deposition
· GIS – Beam chemistry options**
- Platinum deposition
- Tungsten deposition
- Carbon deposition
- Insulator deposition II
- Gold deposition
- Enhanced Etch™ (iodine, patented)
- Insulator enhanced etch (XeF2)
- Delineation Etch™ (patented)
- Selective carbon mill (patented)
- Empty crucibles for FEI approved user supplied materials
- More beam chemistries available upon request
· FIB Charge Neutralizer
· Analysis: EDS, WDS
· FEI acoustic enclosure
· FEI CryoCleaner
Software options*
· Guided TEM sample preparation workflow
· iFast advanced automation suite for DualBeam
· MAPS™ for automatic acquisition of large images and optional correlative work
· AutoTEM™ wizard automated sample preparation with section wizard
· NanoBuilder™ – advanced FEI proprietary CAD based (GDSII) solutions for FIB and beam deposition optimized nanoprototyping of complex structures
· AutoSlice and View™ – automated sequential mill and view to collect series of slices images or EDS maps for 3D reconstruction
· Avizo for FEI – 3D reconstruction and analysis software
· CAD navigation
· Web enabled data archive software
· Advanced image analysis software
Warranty and training
· 1 year warranty
· Choice of service maintenance contracts
· Choice of operation/application training contracts
Documentation and support
· Online user guidance
· User operation manual
· Prepared for RAPID™ (remote diagnostic support)
· Free access to “FEI for Owners” online resources
* Optional
** Some Beam Chemistries may be available only on the MultiChem or on the Single GIS
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