Helios G4 UX 用于材料科学聚焦离子束电子束双束系统

Electron optics

· Elstar extreme high-resolution field emission SEM column with:

- Immersion magnetic objective lens

- High-stability Schottky field emission gun to provide stable high-resolution analytical currents

- UC+ monochromator technology

· 60 degree dual objective lens with pole piece protection allows tilting larger samples

· Automated heated apertures to ensure cleanliness and touch free aperture exchange

· Electrostatic scanning for higher deflection linearity and speed

· ConstantPower™ lens technology for higher thermal stability

· Integrated Fast Beam Blanker*

· Beam deceleration with stage bias from 0 V to -4 kV

· Minimum source lifetime: 12 month

Electron beam resolution

· At optimum WD:

- 0.6 nm at 30 kV STEM

- 0.7 nm at 1 kV

- 1.0 nm at 500 V (ICD)

· At coincident point:

- 0.6 nm at 15 kV

- 1.2 nm at 1 kV

Electron beam parameter space

· Electron beam current range: 0.8 pA to 100 nA

· Accelerating voltage range: 200 V –30 kV

· Landing energy range: 20 eV – 30 keV

· Maximum horizontal field width: 2.3mm at 4 mm WD

Ion optics

Phoenix ion column with superior high current and low voltage performance

· Ion beam current range: 0.1 pA – 65 nA

· Accelerating voltage range: 500 V –30 kV

· 2-stage differential pumping

· Time-of-flight (TOF) correction

· 15-position aperture strip

· Maximum horizontal field width: 0.9 mm at beam coincidence point

· Minimum source lifetime: 1,000 hours Ion beam resolution at coincident point

· 4.0 nm at 30 kV using preferred statistical method

· 2.5 nm at 30 kV using selective edge method

Detectors

· Elstar in-lens SE/BSE detector (TLD-SE, TLD-BSE)

· Elstar in-column SE/BSE detector (ICD)

· Elstar in-column BSE detector (MD)

· Everhart-Thornley SE detector (ETD)

· IR camera for viewing sample/column

· High performance ion conversion and electron (ICE) detector for secondary ions (SI) and electrons (SE)

· In-chamber Nav-Cam™ sample navigation camera

· Retractable low voltage, high contrast directional solid-state backscatter electron detector (DBS)*

· Retractable STEM 3+ detector with BF/ DF/ HAADF segments*

· Integrated beam current measurement

Stage and sample

High precision 5-axis motorized stage, with XYR axis piezo driven

· XY range: 150 mm

· Z range: 10 mm

· Rotation: 360° (endless)

· Tilt range: -10° to +60°

· XY repeatability: 1 μm

· Max sample height: Clearance 55 mm to eucentric point

· Max sample weight at 0° tilt: 500 g(including sample holder)

· Max sample size: 150 mm with full rotation (larger samples possible with limited rotation)

· Compucentric rotation and tilt

Vacuum system

· Complete oil-free vacuum system

· Chamber vacuum: < 2.6×10-6 mbar(after 24 h pumping)

· Evacuation time: < 5 minutes

Chamber

· E- and I-beam coincidence point at analytical WD (4 mm SEM)

· Ports: 21

· Inside width: 379 mm

· Integrated plasma cleaner

Sample holders

· High-resolution multi-stub mount holder

· Vise specimen holder to clamp irregular, large or heavy specimens to the specimen stage*

· Universal mounting base (UMB) for stable, flexible mounting of many combinations of samples and holders

such as flat and pretilt stubs, and row holders for TEM grids*

· Various wafer and custom holder(s) available by request*

Image processor

· Dwell time range from 25 ns – 25 ms/pixel

· Up to 6144 × 4096 pixels

· File type: TIFF (8, 16, 24-bit), BMP or JPEG standard

· SmartSCAN™ (256 frame average or integration, line integration and averaging, interlaced scanning)

· DCFI (Drift Compensated Frame Integration)

System control

· 64-bit GUI with Windows 7, keyboard, optical mouse

· Up to four live images showing independent beams and/or signals. Live color signal mixing

· Local language support: Check with your local FEI Sales representatives for available language packs

· Two 24-inch widescreen monitors (1920×1200 pixels) for system GUI and full-screen image

· Microscope controlling and support computers seamlessly sharing one keyboard, mouse and monitors

· Joystick*

· Multifunctional control panel*

· Remote control and imaging*

Supporting software

· ‘Beam per view’ graphical user interface concept, with up to 4 simultaneously active quads

· FEI SPI™ (simultaneous FIB patterning and SEM imaging), iSPI™ (intermittent SEM imaging and FIB patterning), iRTM™ (integrated real time monitor) and FIB immersion mode for advanced, real-time SEM and FIB process monitoring and

endpointing

· Patterns supported: lines, rectangles, polygons, circles, donut, crosssection and cleaning cross-section

· Directly imported BMP file or stream file for 3D milling and deposition

· Material file support for ‘minimum loop time’, beam tuning and independent overlaps

· Image registration enabling sample navigation in an imported image

· Sample navigation on an optical image

Accessories*

· GIS (Gas Injection System) – Solutions:

- Single GIS: up to 5 independent units for enhanced etching or deposition

- MultiChem™: up to 6 chemistries on the same unit for advanced etching and deposition controls

· GIS – Beam chemistry options**

- Platinum deposition

- Tungsten deposition

- Carbon deposition

- Insulator deposition II

- Gold deposition

- Enhanced Etch™ (iodine, patented)

- Insulator enhanced etch (XeF2)

- Delineation Etch™ (patented)

- Selective carbon mill (patented)

- Empty crucibles for FEI approved user supplied materials

- More beam chemistries available upon request

· EasyLift™ for precise in situ sample manipulation

· FIB Charge Neutralizer

· Analysis: EDS, EBSD, WDS

· QuickLoader™: Loadlock for fast sample exchange without breaking system vacuum

· Cryo solution for DualBeam

- Exclusive FEI CryoMAT for material science cryo applications

- Solutions from external vendors

· FEI acoustic enclosure

· FEI CryoCleaner

Software options*

· Guided TEM sample preparation workflow

· iFast advanced automation suite for DualBeam

· MAPS™ for automatic acquisition of large images and optional correlative work

· AutoTEM™ wizard automated sample preparation with section wizard 

· NanoBuilder™ – advanced FEI proprietary CAD based (GDSII)

solutions for FIB and beam deposition optimized nanoprototyping of complex structures

· AutoSlice and View™ – automated sequential mill and view to collect series of slices images, EDS or EBSD maps for 3D reconstruction

· Avizo for FEI – 3D reconstruction and analysis software

· CAD navigation

· Web enabled data archive software

· Advanced image analysis software

Warranty and training

· 1 year warranty

· Choice of service maintenance contracts

· Choice of operation/application training contracts

Documentation and support

· Online user guidance

· User operation manual

· Prepared for RAPID™ (remote diagnostic support)

· Free access to “FEI for Owners” online resources

* Optional

** Some Beam Chemistries may be available only on the MultiChem or on the Single GIS