DIN EN 60749-16:2003 半导体器件.机械和气候试验方法.第16部分:粒子碰撞噪声探测(PIND)
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003); German version EN 60749-16:2003
The test described in this standard is used to detet the presence of loose particles inside a cavity device, such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).