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Semiconductor devices. Discrete devices. Part 7: Bipolar transistors
Semiconductor devices. Discrete devices. Part 4: Microwave diodes and transistors
Semiconductor devices. Discrete devices. Part 8: Field-effect transistors
Semiconductor devices. Discrete devices. Part 6:Thyristors. Section two. Blank detail specification for bidirectional triode thyristors (triacs), ambient or case-rated, up to 100 A
The standard also bears a QC number. This number, QC 700000, is the specification number in the IEC Quality Assessment System for Electronic Components (IECQ). It is a generic specification for semiconductor devices, discrete devices and integrated circuits, but excluding optoelectronic devices and hybrid circuits. Defines general procedures for quality assessment to be used in the IECQ system and gives general rules for: - methods of measurement of electrical characteristics.
Semiconductor devices. Part 10: Generic specification for discrete devices and integrated circuits
Quartz crystal units for frequency control and selection. Part 3: Standard outlines and lead connections
Optical fibres. Part 1: Generic specification
The standard applies to encapsulated semiconductors integrated circuits, including multichip integrated circuits, but excluding hybrid circuits. It gives details of the Quality Assessment Procedures, the inspection requirements, screening sequences, sampling requirements, test and measurements procedures required for the assessment of semiconductor integrated circuits, including digital, analogue and interface circuits.
Semiconductor devices. Integrated circuits. Part 11: Section specification for semiconductor integrated circuits excluding hybrid circuits
Semiconductor devices. Integrated circuits.Part 1: General
Environmental testing. Part 2: Tests. Guidance for damp heat tests
The standard lays down requirements for flexible or semi-flexible radio-frequency cables of coaxial or twin conductor types designed for use in radio-communication equipment and in electronic devices employing similar techniques. The dielectric may be solid, air space, or semi-solid-air-spaced types, consisting of thermoplastic of low-loss polymeric resin or of a thermosetting compound, or of a mineral material.
Radio-frequency cables. Part 0: Guide to the design of detail specifications. Section 1: Coaxial cables
Printed boards. Part 4: Specification for single and double sided printed boards with plain holes
The standard is applicable to fixed chip resistors for use in electronic equipment. It prescribes preferred ratings and characteristics and selects the appropriate Quality Assessment procedures, tests and measuring methods and gives general performance requirements for this type of resistor.
Fixed resistors for use in electronic equipment. Ppart 8: Sectional specification: Fixed chip resistors. Assessment level E
Inductor and transformer cores for telecommunications. Part 2: Sectional specification. Magnetic oxide cores for induction applications
Semiconductor devices. Discrete devices. Part 2: Rectifier diodes. Section one: Blank detail specification for rectifier diodes (including avalanche rectifier diodes), ambient and case-rated, up to 100 A
Supplementary document to the Sectional Specification which contains requirements for style and layout and minimum content of detail specifications.
Fixed resistors for use in electronic equipment. Part 8: Blank detail specification. Fixed chip resistors. Assessment level E
Printed boards. Part 8: Specification for single and double sided flexible printed boards with through connection
Electromechanical components for electronic equipment. Basic testing procedures and measuring methods. Part 7: Mechanical operating tests and sealing tests
Quartz crystal units for frequency control and selection. Part 3: Standard outlines and lead connections. Fourth supplement
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