共找到 779 条与 钎焊和低温焊 相关的标准,共 52 页
What is ISO 9453 about? ISO 9453 is an international standard that deals with soft solder alloys. ISO 9453 specifies the requirements for chemical composition, forms of delivery, sampling, analysis as well as marking and labelling for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium. An indication of the forms generally available is also included in ISO 9453. Who is ISO 9453 for? ISO 9453 on soft solder alloys applicable to: Electronic and electrical Industries
Soft solder alloys. Chemical compositions and forms
What is ISO 9455‑5 about? ISO 9455 ‑ 5 is the fifth element of the multi-series international standard that covers the soft soldering fluxes . ISO 9455 ‑ 5 gives technical specifications such as terms, definitions, principles, reagents, apparatus, procedure, assessment, expression of results, and test reports for copper mirror test. It specifies a qualitative method for assessing the aggressiveness of flux towards copper. Note: The test is applicable to all fluxes of type 1 as defined in ISO 9454‑1. Who is ISO 9455‑5 for? ISO 9455‑5 on copper mirror test is applicable to: Electronic and Electrical Industries Soft soldering fluxes manufacturers Welding equipment manufacturers Manufacturer of aircraft & ...
Soft soldering fluxes. Test methods - Copper mirror test
Soft soldering fluxes — Test methods — Part 9: Determination of ammonia content
This document specifies the performance requirements for fluxes in solid, liquid and paste forms intended for use with soft solders. NOTE 1 ISO 9454-1 specifies the requirements for labelling and packaging as well as the coding system for the classification of the fluxes. NOTE 2 Some of the fluxes intended for inert gas and vapour phase soldering may not pass some of the criteria in Tables 1 and 2. Requirements for these fluxes are agreed between the purchaser and the supplier.
Soft soldering fluxes — Classification and requirements — Part 2: Performance requirements
This document specifies a qualitative method for assessing the aggressiveness of a flux towards copper. The test is applicable to all fluxes of type 1 as defined in ISO 9454‑1.
Soft soldering fluxes - Test methods - Part 5: Copper mirror test (ISO 9455-5:2020)
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium. An indication of the forms generally available is also included.
Soft solder alloys - Chemical compositions and forms (ISO 9453:2020)
This document specifies a qualitative method for assessing the aggressiveness of a flux towards copper. The test is applicable to all fluxes of type 1 as defined in ISO 9454-1.
Soft soldering fluxes — Test methods — Part 5: Copper mirror test
1.1 This specification covers solder metal alloys (commonly known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tinantimony-copper-silver, tin-antimony-copper-silver-nickel, tinsilver, tin-copper-silver, and lead-tin-silver, used for the purpose of joining together two or more metals at temperatures below their melting points. Electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications are not covered by this specification as they are under the auspices of IPC – Association Connecting Electronic Industries. 1.1.1 These solders include those alloys having a liquidus temperature not exceeding 800°F (430°C). 1.1.2 This specification includes solders in the form of solid bars, ingots, powder and special forms, and in the form of solid and flux-core ribbon, wire, and solder paste. 1.2 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard. 1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to become familiar with all hazards including those identified in the appropriate Safety Data Sheet (SDS) for this product/material as provided by the manufacturer, to establish appropriate safety, health, and environmental practices, and determine the applicability of regulatory limitations prior to use. 1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
Standard Specification for Solder Metal
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium. An indication of the forms generally available is also included.
Soft solder alloys — Chemical compositions and forms
This document specifies the classification of fluxes used for brazing metals and characterizes these fluxes on the basis of their properties and use, and gives technical delivery conditions and health and safety precautions. This document covers two classes of flux, FH and FL. Class FH is used for the brazing of heavy metals (steels, stainless steels, copper and its alloys, nickel and its alloys, precious metals, molybdenum and tungsten). Class FL is used for the brazing of aluminium and its alloys.
Brazing — Fluxes for brazing — Classification and technical delivery conditions
This document specifies two methods for the determination of the acid value of a flux of types 1 and 2 only, as defined in ISO 9454‑1. Method A is a potentiometric titration method and is to be considered as the reference method. Method B is an alternative, visual end‑point, titration method.
Soft soldering fluxes - Test methods - Part 3: Determination of acid value, potentiometric and visual titration methods (ISO 9455-3:2019)
Soft soldering fluxes — Classification and requirements — Part 2: Performance requirements
Soft soldering fluxes — Test methods — Part 8: Determination of zinc content
Soft soldering fluxes — Test methods — Part 8: Determination of zinc content
Soft soldering fluxes — Classification and requirements — Part 2: Performance requirements
本标准规定了电机制造用银钎料的型号、基本要求、技术要求、试验方法、检验规则、标志、包装、运输、贮存和质量承诺。 本标准适用于电机制造使用的银钎料。
Silver brazing filler metals for electric motor manufacture
Soft soldering fluxes — Classification and requirements — Part 1: Classification, labelling and packaging
Soft soldering fluxes — Classification and requirements — Part 1: Classification, labelling and packaging
What is ISO 9455 ‑ 16 - Soft soldering fluxes about? ISO 9455 ‑ 16 specifies a method for the assessment of the efficacy of a soft soldering flux, known as the wetting balance method, and gives a qualitative assessment of the comparative efficacy of two fluxes based on their capacity to promote the wetting of a metal surface by liquid solder. The method in ISO 9455 ‑ 16 is applicable to all flux types in liquid form classified in ISO 9454-1. NOTE: It is hoped that future developments using improved techniques for obtaining a reproduci...
Soft soldering fluxes. Test methods - Flux efficacy test, wetting balance method
Copyright ©2007-2022 ANTPEDIA, All Rights Reserved
京ICP备07018254号 京公网安备1101085018 电信与信息服务业务经营许可证:京ICP证110310号