31.220 电子电信设备用机电元件 标准查询与下载

IPC TM-650 2.4.24.4-1998 用在高密度互连(HDI)宣布与微通的材料的玻璃化转变和模量 -DMA的方法

The ad hoc team choose to use the round robin approach to quantitatively measure the . effects of each variable at several levels. The round robin was developed and executed as a joint effort to minimize disagreements and maximize accuracy. The Steam Aging Round Robin was developed and approved by June 1989 (see Appendix A).

Glass Transition and Modulus of Materials Used in High Density Interconnection (HDI) and Microvias - DMA Method

IPC TM-650 2.6.24-1998 在环境条件下的连结稳定

Whether a printed circuit is to be a prototype, or a high-volume

Junction Stability Under Environmental Conditions

IPC TM-650 5.5.1.2-1998 IPC-A-23 - IPC-TF-870描述

In May 1995 the IPC’s Technical Activities Executive Committee (TAEC) adopted Principles of Standardization as a guiding principle of IPC’s standardization efforts.

IPC-A-23 - IPC-TF-870 Qualification

IPC TM-650 5.5.2.2-1998 试验方法2.6.3.2 -保温和防潮性能

To determine the resistance of the laminate to thermal stress in both the etched and unetched state.

Test Method 2.6.3.2 - Insulation and Moisture Resistance

SJ/T 11137-1997 寻呼机用永磁式直流电动机

本标准规定了寻呼机用永磁式直流电动机的技术要求、试验方法、检验规则、标志、包装、运输和储存。 本标准适用于寻呼机上产生振动信号的永磁式直流电动机。

permanent magnet d.c.motors for pagers

IPC TM-650 2.5.3-1997 镀通孔电流击穿 修订版B

The intent of this specification is to provide a standard method for developing process control files used by electronics manufacturing equipment. Process control files (often referred to as recipes) provide the instruction sets used by assembly equipment to accomplish specified tasks.

Current Breakdown, Plated Through-Holes Revision B

IPC TR-465-3-1996 程序IIA阶段,替代饰面循环赛测试中的蒸汽老化评价

TEST METHOQS MANUAL

Evaluation of Steam Aging on Alternative Finishes Round Robin Test Program Phase IIA

IPC TR-467-1996 ANSI与J-STD-001B的支持数据和实例:附录D(管制通量)

IPC Artwork

Supporting Data and Numerical Examples for ANSI/J-STD-001B: Appendix D (Control of Fluxes)

IPC TM-650 2.3.40-1995 热稳定性

Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

Thermal Stability

IPC TM-650 2.4.22.2-1995 衬底曲率:硅片与电介质沉积

Recommended Standards and Publications are adopted by IPC without regard to whether their adoption may involve patents on articles, materials, or processes. By such action, IPC does not assume any liability to any patent owner, nor do they assume any obligation whatever to parties adopting the Recommended Standard or Publication. Users are also wholly responsible for protecting themselves against all claims of liabilities for patent infringement

Substrate Curvature: Silicon Wafers with Deposited Dielectrics

IPC TM-650 2.4.1.5-1995 治疗转移测定

Determination of Treatment Transfer

Determination of Treatment Transfer

IPC TM-650 2.3.27.1-1995 松香通量残留分析方法-高效液相色谱法

Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

Rosin Flux Residue Analysis - HPLC Method

IPC TM-650 2.3.27-1995 残余松香的清洁度测试

Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

Cleanliness Test - Residual Rosin

IPC TM-650 2.4.34.4-1995 糊通量粘度-笔杆主轴方法

This document is intended to provide a blueprint of key integrated information technology (IT) areas to help PWB manufacturers effectively and efficiently operate their businesses.

Paste Flux Viscosity - T-Bar Spindle Method

IPC TM-650 2.4.47-1995 通量残留燥

This standard specifies the XML schema that represents the data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, inspection and testing requirements. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most useful when the manufacturing cycle includes computer-aided processes and numerical control machines.

Flux Residue Dryness

IPC TM-650 2.4.51-1995 自匀热导电胶

This standard specifies data formats used to describe printed circuit board assembly product manufacturing methodologies. These formats may be used for transmitting information between a printed circuit board designers, board fabricators, and assembly manufacturers. The formats are also useful when the manufacturing cycle includes computer-aided processes and numerical control machines.

Self Shimming Thermally Conductive Adhesives

IPC TR-466-1995 润湿平衡的标准重量比较试验

THE IHSTITUTE FOR IHTERCOHHECTIHG ANO PACKAGING ELECTROHIC CIRCUITS

Wetting Balance Standard Weight Comparison Test

IPC TM-650 2.4.25-1994 用DSC玻璃化转变温度和治愈的因素 修订本C 1994年12月

IPC Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of IPC from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than IPC members, whether the standard is to be used either domestically or internationally.

Glass Transition Temperature and Cure Factor by DSC; Revision C - December 1994

IPC TM-650 2.4.24.1-1994 时间分层(TMA的方法)

IPC-TR-464 was originally published in April of 1984. This Technical Report was developed to meet the growing need for a standard method of evaluating the solderability retention capability of printed circuit parts during inventory storage. The report indicated that a 1-4 hour aging procedure was in'adequate to assure the level of acceptable solderability required by the industry. A 20-24 hour aging times was recommended. Since the initial publications of IPC-TR-464, additional research has taken place on accelerated aging; better leadltermination coatings are being used to meet aging requirements imposed by the industry. In 1986 the Accelerated Aging Task Group of the IPC was reactivated to . evaluate the most recent research to determine if the aging period could be shorted, and still provide the appropriate information on solderability retention. This addendum to IPC-TR-464 published December 1987 represents the results of the task group study.

Time to Delamination (TMA Method)

IPC TR-582-1994 第3阶段-在处理环境空气中低固体通量和膏状物,清洁和洁净度测试程序测试结果

In 1988, foreseeing the tremendouesf forts required to change to CFC alternatives,t he ad hoc Solvents Working Group (AHSWG) was formed by Dr. Stephen Andersen of the EPA. The AHSWG was comprised of: Department of Defense (DoD) representatives, military defense contractors, commercial manufacturersm, aterial suppliers, equipment manufacturers, the Institute for Interconnecting and Packaging Electronic Circuits (IPC), and the Environmental Protection Agency (EPA). The goal of the AHSWG was to assist the transition efforts by investigating and characterizing CFC-alternative materials and processes.

Cleaning and Cleanliness Testing Program Test Results for: Phase 3 - Low Solids Fluxes and Pastes Processed in Ambient Air