L10 电子元件综合 标准查询与下载

IEC 62037-3:2012 无源无线电频率(RF)和微波器件,内调水平测量.第3部分:同轴电缆连接器中的无源互调测量

Passive RF and microwave devices, intermodulation level measurement - Part 3: Measurement of passive intermodulation in coaxial connectors

IEC 62037-4:2012 无源无线电频率(RF)和微波器件,内调水平测量.第4部分:同轴电缆中的无源互调测量

This part of IEC 62037 defines test fixtures and procedures recommended for measuring levels of passive intermodulation generated by coaxial cables. Two dynamic test methods and a static test method are defined. All coaxial cables are subjected to the static and clamped cable loop dynamic test. Cables classified as flexible or semi-flexible are additionally subjected to the flexing tool dynamic test.

Passive RF and microwave devices, intermodulation level measurement - Part 4: Measurement of passive intermodulation in coaxial cables

IEC 62037-1:2012 无源无线电频率(r.f.)和微波器件,互调电平测量.第1部分:通用要求和测量方法

This part of IEC 62037 deals with the general requirements and measuring methods for intermodulation (IM) level measurement of passive RF and microwave components@ which can be caused by the presence of two or more transmitting signals. The test procedures given in this standard give the general requirements and measurement methods required to characterize the level of unwanted IM signals using two transmitting signals. The standards in this series address the measurement of PIM@ but do not cover the long term reliability of a product with reference to its performance. This standard is to be used in conjunction with other appropriate part(s) of IEC 62037.

Passive r.f. and microwave devices, Intermodulation level measurement - Part 1: General requirements and measuring methods

QC 080000-2012 IEC电子元器件质量评定体系 (IECQ体系). 有害物质过程管理体系要求 (HSPM)

IEC Quality Assessment System for Electronic Components (IECQ System) - Hazardous Substance Process Management System Requirements (HSPM)

BS EN 62137-3:2012 电子装配技术.焊缝用环境和耐久性试验方法的选择指南

Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints

ANSI/GEIA STD-0008-2012 电子元件降额

Specifies the minimum derating requirements for using electronic components in moderately severe environments. This Standard is intended to supersede the derating limits contained in DPSO SD-18, Naval Standard TE000, and Air Force ESD-TR-85-148. Standard is not intended for space applications, which have their own pre-existing standards.

Derating of Electronic Components

ASTM F106-12 电子器件射线检测质量控制方法

1.1 This specification covers requirements or filler metals suitable for brazing internal parts and other critical areas of electron devices in a nonoxidizing atmosphere (Note 1). 1.2 These materials are available in strip or wire or preforms made by blanking the strip or bending the wire. Powders are also available. Note 18212;Brazing filler metals for general applications are specified in AWS Specification A 5.8. 1.3 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.

Standard Specification for Brazing Filler Metals for Electron Devices

ANSI/NISO Z39.85-2012 都柏林核心元数据集

The Dublin Core Metadata Element Set

GJB 546B-2011 电子元器件质量保证大纲

本标准规定了电子元器件质量保证大纲实施和管理的准则及要求。 本标准适用于为确保质量稳定，需对设备、材料和过程进行控制的电子元器件。本标准是承制方进行电子元器件生产线认证时，制定和实施质量保证大纲的基本依据。适用时，本标准是鉴定机构进行生产线认证审查的依据。承制方按有关产品规范鉴定电子元器件之前，应首先满足质量保证大纲要求。

Quality assurance program for electronic parts

GJB 2649A-2011 军用电子元件失效率抽样方案和程序

本标准规定了按选定的置信度确定和维持失效率等级的抽样方案，以及失效率等级的鉴定和批一致性检验程序。本标准规定的表格和数值以指数分布作依据，某些元件（如电容器）允许以威布尔分布作依据，但须经鉴定机构批准。电子元件的设计应基本相同，生产应基本连接，生产工艺控制应符合GJB 546《电子元器件质量保证大纲》的规定。 本标准适用于有失效率等级的军用电子元件产品规范中规定的失效率试验。

Failure rate sampling plans and procedures for military electronic component parts

GJB 1426A-2011 功率分配器、功率合成器和功率分配/合成器通用规范

本规范规定了功率分配器、功率合成器以及功率分配/合成器的通用要求、质量保证规定和交货准备等。 本规范适用于功率分配器、功率合成器以及功率分配/合成器（简称产品）。

General specification for power dividers,power combiners and power dividers/combiners

DB41/T 705-2011 电液阀门驱动装置

Electro-hydraulic valve actuator

JIS C 62137-1-4:2011 表面安装技术.表面安装焊接接头的环境和耐久试验法.第1-4部分:往复弯曲试验

Surface mounting technology -- Environmental and endurance test methods for surface mount solder joint -- Part 1-4: Cyclic bending test

JIS C 62137-1-5:2011 表面安装技术.表面安装焊接接头的环境和耐久试验法.第1-5部分:机械剪切疲劳试验

Surface mounting technology -- Environmental and endurance test methods for surface mount solder joints -- Part 1-5: Mechanical shear fatigue test

DB41/T 704-2011 阀门遥控系统

Valve remote control system

JIS C 62137-1-3:2011 表面安装技术.表面安装焊接接头的环境和耐久试验法.第1-3部分:往复落锤试验

Surface mounting technology -- Environmental and endurance test methods for surface mount solder joint -- Part 1-3: Cyclic drop test

BS IEC 62016:2011 电子学领域的核心模型

Core model of the electronics domain

JIS C 5270:2011 电子设备用电容器和电阻器.轴端,衬套和单孔衬套安装轴驱动电子元器件安装的优选尺寸规格

Capacitors and resistors for use in electronic equipment -- Preferred dimensions of shaft ends, bushes and for the mounting of single-hole, bush-mounted, shaft-operated electronic components

ISO/TS 10798:2011 纳米技术.使用扫描电镜与X射线能谱分析的单臂碳纳米管的特征描述

Nanotechnologies - Charaterization of single-wall carbon nanotubes using scanning electron microscopy and energy dispersive X-ray spectrometry analysis

NF C03-501:2011 电子元器件标准数据元素类型和相关分类模式.第1部分:定义.原理和方法

Standard data element types with associated classification scheme for electric items - Part 1 : definitions - Principles and methods.