L40 半导体分立器件综合 标准查询与下载
共找到 1197 条与 半导体分立器件综合 相关的标准，共 80 页
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopic examination of plastically encapsulated electronic components
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2024-03-15
- 实施
- 2024-07-01
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2024-03-15
- 实施
- 2024-07-01
Mechanical and Climatic Test Methods for Semiconductor Devices Part 26: Electrostatic Discharge (ESD) Susceptibility Test Human Body Model (HBM)
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2023-09-07
- 实施
- 2024-04-01
Semiconductor Devices Discrete Devices Part 7: Bipolar Transistors
- ICS
- 31.080.30
- CCS
- L40
- 发布
- 2023-09-07
- 实施
- 2024-04-01
Semiconductor devices microelectromechanical devices Part 19: Electronic compass
- ICS
- 31.200
- CCS
- L40
- 发布
- 2023-08-06
- 实施
- 2024-03-01
Long-term storage of electronic components and semiconductor devices - Part 5: Chips and wafers
- ICS
- 31.080
- CCS
- L40
- 发布
- 2023-05-23
- 实施
- 2023-09-01
Long-term storage of electronic components and semiconductor devices Part 2: Degradation mechanisms
- ICS
- 31.020
- CCS
- L40
- 发布
- 2023-05-23
- 实施
- 2023-09-01
Microelectromechanical Devices for Semiconductor Devices Part 5: RF MEMS Switches
- ICS
- 31.200
- CCS
- L40
- 发布
- 2023-05-23
- 实施
- 2023-09-01
Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2023-05-23
- 实施
- 2023-12-01
Mechanical and Climatic Test Methods for Semiconductor Devices Part 27: Electrostatic Discharge (ESD) Susceptibility Test Machine Model (MM)
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2023-05-23
- 实施
- 2023-12-01
Semiconductor devices microelectromechanical devices Part 7: MEMS bulk acoustic wave filters and duplexers for radio frequency control and selection
- ICS
- 31.200
- CCS
- L40
- 发布
- 2023-05-23
- 实施
- 2023-12-01
Mechanical and climatic test methods for semiconductor devices Part 32: Flammability of plastic encapsulated devices (externally induced)
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2023-05-23
- 实施
- 2023-12-01
Semiconductor Devices Mechanical and Climatic Test Methods Part 31: Flammability of Plastic Encapsulated Devices (Internally Induced)
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2023-05-23
- 实施
- 2023-12-01
Semiconductor devices—Mechanical and climatic test methods—Part 42:Temperature and humidity storage
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2023-05-23
- 实施
- 2023-12-01
Semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2018-09-17
- 实施
- 2019-01-01 00:00:00.0
Semiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2018-09-17
- 实施
- 2019-01-01 00:00:00.0
Semiconductor devices—Mechanical and climatic test methods—Part 18: Ionizing radiation (total dose)
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2018-09-17
- 实施
- 2019-01-01 00:00:00.0
Semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2018-09-17
- 实施
- 2019-01-01 00:00:00.0
Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2018-09-17
- 实施
- 2019-01-01 00:00:00.0
Semiconductor devices—Mechanical and climatic test methods—Part 11: Rapid change of temperature—Two-fluid-bath method
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2018-09-17
- 实施
- 2019-01-01 00:00:00.0
