19.040;31.190 标准查询与下载

JIS C 60068-2-69:2019 环境测试 第 2-69 部分：测试 测试 Te/Tc：通过润湿平衡（测力）法对电子元件和印制板进行可焊性测试

Environmental testing -- Part 2-69: Tests -- Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

BS EN 60068-2-69:2017 环境试验. 试验. 试验Te/Tc. 采用湿平衡(力值测量)法的电子元件和印制板焊接性试验

Environmental testing. Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

IEC 60068-2-58:2015/AMD1:2017 环境试验.第2-58部分:试验.试验Td:表面安装元器件(SMD)用可焊性、耐金属化溶融和耐焊接热的试验方法.修改件1

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

IEC 60068-2-58:2017 环境试验.第2-58部分:试验.试验Td:表面安装元器件(SMD)用可焊性、耐金属化溶融和耐焊接热的试验方法

This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD). This standard document provides procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow systems. The solder bath method is applicable to SMDs designed for flow soldering and SMDs designed for reflow soldering when the solder bath (dipping) method is appropriate. The reflow method is applicable to the SMD designed for reflow soldering, to determine the suitability of SMDs for reflow soldering and when the solder bath (dipping) method is not appropriate. The objective of this standard is to ensure solderability of component lead or termination. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. This standard covers tests Td1, Td2 and Td3 as listed below: Number of Td Test Method Td1 Solderability of terminations Method 1: Solder bath Method 2: Reflow Td2 Resistance to soldering heat Method 1: Solder bath Method 2: Reflow Td3 Dewetting and resistance to dissolution of metallization Method 1: Solder bath Method 2: Reflow NOTE 1 For specific components other test methods may exist. NOTE 2 Test Td does not apply to printed wiring board (PWB), see IEC 61189-3. NOTE 3 Specific through-hole devices (where the device supplier has specifically documented support for reflow soldering) are also included in this standard.

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

IEC 60068-2-69:2017 环境试验. 第2-69部分: 试验. 试验Te/Tc: 采用湿平衡(力值测量)法的电子元件和印制板焊接性试验

This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass-fail purposes. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads. This document provides the measurement procedures for solder alloys both with and without lead (Pb).

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

BS EN 60068-2-58:2015 环境试验.试验.试验Td.表面安装设备(SMD)的可焊性,耐金属化溶融和耐焊接热试验方法

Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

IEC 60068-2-58:2015 环境试验.第2-58部分:试验.试验Td:表面安装元器件(SMD)用可焊性、耐金属化溶融和耐焊接热的试验方法

This part of IEC 60068 outlines test Td@ applicable to surface mounting devices (SMD). This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys@ which are eutectic or near eutectic tin lead (Pb)@ or lead-free alloys. The solder bath method is applicable to SMDs designed for flow soldering and SMDs designed for reflow soldering when the solder bath (dipping) method is appropriate. The reflow method is applicable to the SMD designed for reflow soldering@ to determine the suitability of SMDs for reflow soldering and when the solder bath (dipping) method is not appropriate. The objective of this standard is to ensure solderability of component lead or termination. In addition@ test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. NOTE 1 For specific components other test methods may exist. NOTE 2 Test Td does not apply to printed wiring board (PWB)@ see IEC 61189-3. NOTE 3 Specific through-hole devices (where the device supplier has specifically documented support for reflow soldering) are also included in this standard.

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

JIS C 60068-2-83:2014 环境试验. 第2-83部分: 试验. 试验Tf: 利用焊锡膏湿平衡法进行的表面安装设备(SMD)电子元件的焊接性试验

Environmental testing -- Part 2-83: Tests -- Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

KS C IEC 60068-2-69:2012 基本环境试验规程.第2部分:试验.第69节:试验Te:润湿平衡法对表面镶嵌技术用电子元件的软钎焊试验

KS C IEC 60068 시리즈 중 이 표준은 Test Te로, 표면실장부품에 적용할 수

Environmental testing-Part 2-69:Tests-Test Te:Solderability testing of electronic components for surface mounting devices(SMD) by the wetting balance method

LST EN 60068-2-83-2012 环境测试 第 2-83 部分：测试 测试 Tf：使用焊膏通过润湿平衡法对表面安装器件（SMD）的电子元件进行可焊性测试（IEC 60068-2-83:2011）

Environmental testing -- Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste (IEC 60068-2-83:2011)

IEC 60068-2-83:2011 环境试验.第2-83部分:测试.测试Tf:利用焊锡膏润湿平衡法进行的表面安装装置(SMD)电子元件的焊接性试验

This part of IEC 60068 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass ?C fail purposes. NOTE Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method@ IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.

Environmental Testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

KS C IEC 60068-2-21:2010 环境试验.第2-21部分:试验.试验U:端子的坚固性与一体附着装置

이 표준은 단자 또는 일체형 부착 장치의 정상 조립 또는 취급 중에 응력을 받을 수 있는

Environmental testing-Part 2-21:Tests-Test U:Robustness of terminations and integral mounting devices

JIS C 60068-2-69:2009 环境试验.第2-69部分:试验.试验Te:用润湿称量法进行表面安装装置(SMD)电子元件的可焊性试验

This Standard outlines test Te, solder bath wetting balance method and solder globule wetting balance method,applicable for surface mounting devices.

Environmental testing -- Part 2-69: Tests -- Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

JIS C 60068-2-82:2009 环境试验.第2-82部分:试验.试验XW1:电子和电气元件用晶须试验方法

This Standard specifies whisker tests for electric or electronic components representing the finished stage,with tin or tin-alloy finish.

Environmental testing -- Part 2-82: Tests -- Test XW1: Whisker test methods for electronic and electric components

LST EN 60068-2-69-2007 环境测试 第 2-69 部分：测试 测试 Te：采用润湿平衡法对表面安装器件（SMD）的电子元件进行可焊性测试（IEC 60068-2-69:2007）

Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method (IEC 60068-2-69:2007)

LST EN 60068-2-82-2007 环境测试 第 2-82 部分：测试 测试 Tx：电子和电气元件的晶须测试方法（IEC 60068-2-82:2007）

Environmental testing - Part 2-82: Tests - Test Tx: Whisker test methods for electronic and electric components (IEC 60068-2-82:2007)

IEC 60068-2-69:2007 环境测试.第2-69部分:试验.试验Te:用润湿称量法进行表面安装装置(SMD)的电子元件的可焊性测试

This part of IEC 60068 outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively the solderability of terminations on surface mounting devices. IEC 60068-2-54 is also available for surface mounting devices and should be consulted if applicable. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are both applicable to components with metallic terminations and metallized solder pads. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.

Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

LST EN 60068-2-21-2006 环境测试 第 2-21 部分：测试 测试 U：端接和整体安装装置的稳健性（IEC 60068-2-21:2006）

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices (IEC 60068-2-21:2006)

IEC 60068-2-21:2006 环境试验.第2-21部分:试验.试验U:引出端及整体安装件强度

This part of IEC 60068 is applicable to all electrical and electronic components whose terminations or integral mounting devices are liable to be submitted to stresses during normal assembly or handling operations.

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

LST EN 60068-2-58+AC-2005 环境测试 第 2-58 部分：测试 测试 Td：表面安装器件（SMD）的可焊性、耐金属化溶解和焊接热的测试方法（IEC 60068-2-58:2004）

Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2004)