IPC 7091-2017
3D 组件的设计和装配过程实施

Design and Assembly Process Implementation of 3D Components

非常抱歉，我们暂时无法提供预览，您可以试试： 免费下载 IPC 7091-2017 前三页，或者稍后再访问。

您也可以尝试购买此标准，
点击右侧 “购买” 按钮开始采购（由第三方提供）。

注意： 点击下载后，生成下载文件时间比较长，请耐心等待......

标准号

IPC 7091-2017

发布

2017年

发布单位

IPC - Association Connecting Electronics Industries

当前最新

IPC 7091-2017

 

 

适用范围

This document describes the design and assembly challenges and ways to address those challenges for implementing 3D component technology. Recognizing the effects of combining multiple uncased semiconductor die elements in a singlepackage format can impact individual component characteristics and can dictate suitable assembly methodology. The information contained in this standard focuses on achieving optimum functionality@ process assessment@ end-product reliability and repair issues associated with 3D semiconductor package assembly and processing Purpose Performance-driven electronic systems continue to challenge companies in search of more innovative semiconductor package methodologies. The key market driver for semiconductor package technology is to provide greater functionality and improved performance without increasing package size. The package interposer is the key enabler. Although glass-reinforced epoxy-based materials and high-density copper interconnect capability will continue to have a primary role for array-configured packaging@ there is a trend toward alternative dielectric platforms as well as toward combining multiple functions within the same die element. To address this movement@ an increasing number of semiconductor die developed for advanced applications now require higher I/O with contact pitch variations that are significantly smaller than the mainstream semiconductor products previously in the market. For these applications@ companies are developing interposer technologies that can provide interconnect densities far superior to organic-based counterparts

IPC 7091-2017相似标准

推荐