1 Scope This document specifies a method for measuring the thermal resistance between a heater chip and a cold plate with the heater chip mounted on a metalized ceramic substrate , imitating a silicon carbide (SiC) high-output power module. This measurement represents an index of the heat dissipation characteristics of a metallized ceramic substrate used in a high-output power module.
BS ISO 4825-1:2023由英国标准学会 GB-BSI 发布于 2023-01-31,并于 2023-01-31 实施。
BS ISO 4825-1:2023在国际标准分类中归属于: 81.060.30 高级陶瓷。
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