Statement of Scope This specification covers qualification and performance of rigid printed boards. The printed board may be single-sided@ double-sided@ with or without plated-through holes. The printed board may be multilayer with plated-through holes and with or without buried/blind vias. The printed board may be multilayer containing build up HDI layers conforming to IPC-6016. The printed board may contain active embedded passive circuitry with distributive capacitive planes@ capacitive or resistive components. The printed board may contain a metal core or external metal heat frame@ which may be active or nonactive. Revision level changes are described in 1.6.Purpose The purpose of this specification is to provide requirements for qualification and performance of rigid printed boards.