BS EN 61249-4-1-2008
印制电路板和其它互连结构用材料.(多层板的加工用)非包覆预浸料的分规范集.规定易燃性的环氧化合物机织E型玻璃预浸料坯
Materials for printed boards and other interconnecting structures - Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability