For those high pin count components (e.g., ball grid array) that interconnect different power leads through common, low-resistance power and ground planes in the package, the number of power and ground leads can be reduced by ganging or grouping supply pins together on a custom test fixture board. A minimum number of power supply pins (i.e., power or ground) should be ganged to bring the total number of tester channels used equal to the number of tester channels available on the tester.
NOTE: ANSI/ESD SP5.2.1 does not cover the testing of the signal pins of high pin count devices. It is recommended to use ANSI/ESD SP5.2.2.