KS C IEC 61249-2-32-2011 印刷电路板和其他互连结构用材料.第2-32部分:包覆和非包覆增强基材.铜包覆限定介电常数(1GHz下≤3.7)和易燃性(垂直燃烧试验)的环氧编织E型玻璃层压板材卤化的改良或非改良树脂系统
Materials for printed boards and other interconnecting structures-Part 2-32:Reinforced base materials, clad and unclad-Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3