JIS C 60068-2-69 AMD 1:2021 环境试验. 第2-69部分: 试验. Te/Tc试验: 通过润湿平衡(力测量)方法对电子元件和印刷电路板的可焊性测试(修改件1)
Environmental testing -- Part 2-69: Tests -- Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (Amendment 1)