31.190 电子元器件组件 标准查询与下载

EN 62137-1-3:2009 表面贴装技术 表面贴装焊点的环境和耐久性试验方法 第 1-3 部分：循环跌落试验

The test method described in IEC 62137-1-3:2008 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs). This test is intended to evaluate the strength of the solder joints of larger sized multi-terminal components and other components in devices (e.g. handheld mobile devices) in the event that the device is dropped. The properties of the solder joints (e.g. solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test

GSO IEC 61193-2:2008 质量评估体系 第2部分：电子元件和组件检验抽样计划的选择和使用

Applies to the inspection of electronic components, packages, and also modules (referred to as "products in this standard) for use in electronic and electric equipment. It specifies sampling plans for inspection by attributes on the assumption that the acceptance number is zero (Ac = 0), including criteria for sample selection and procedures.

Quality assessment systems - Part 2 : Selection and use of sampling plans for inspection of electronic componets and packages

DIN EN 62421:2008 电子组装技术.电子模块

Electronics assembly technology - Electronic modules (IEC 62421:2007); German version EN 62421:2007

LST EN 61193-2-2008 质量评估系统 第2部分：电子元件和包装检验抽样计划的选择和使用（IEC 61193-2:2007）

Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages (IEC 61193-2:2007)

LST EN 62421-2008 电子装配技术 电子模块（IEC 62421:2007）

Electronics assembly technology - Electronic modules (IEC 62421:2007)

DS/EN 62421:2008 电子装配技术-电子模块

This International Standard provides a generic standard of electronic modules on which their sectional standards are based.This standard provides a definition, business model, interface between the trading partners, and related areas of standardization of electronic modules. In addition a generic set of test method is provided.

Electronics assembly technology - Electronic modules

NF C90-730-5:2008 焊接电子组件的工艺质量要求.第5部分:焊接电子组件的重作、修改和修理

Workmanship requirements for soldered electronic assemblies - Part 5 : rework, modification and repair of soldered electronic assemblies.

DS/EN 61193-2:2008 质量评估系统 第2部分：电子元件和包装检验抽样计划的选择和使用

This part of IEC 61193 applies to the inspection of electronic components, packages, and alsomodules (referred to as “products” in this standard) for use in electronic and electric equipment. It specifies sampling plans for inspection by attributes on the assumption that the acceptance number is zero (Ac = 0), including criteria for sample selection and procedures.The zero acceptance number sampling plans provided by this standard apply to the inspection of products, that are manufactured under suitable process control with the target of a “zerodefect”quality level before sampling inspection.In addition, this standard provides a method for the calculation o

Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages

LST EN 62137-1-1-2008 表面贴装技术 表面贴装焊点的环境和耐久性测试方法 第 1-1 部分：拉力测试（IEC 62137-1-1:2007）

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test (IEC 62137-1-1:2007)

LST EN 62137-1-2-2008 表面贴装技术 表面贴装焊点的环境和耐久性测试方法 第 1-2 部分：剪切强度测试（IEC 62137-1-2:2007）

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test (IEC 62137-1-2:2007)

DS/EN 62137-1-1:2008 表面安装技术 表面安装焊点的环境和耐久性试验方法 第 1-1 部分：拉力试验

The test method described in this part of IEC 62137 is applicable to gull-wing lead surface mounting components.The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

DS/EN 62137-1-2:2008 表面安装技术 表面安装焊点的环境和耐久性试验方法 第 1-2 部分：剪切强度试验

The test method described in this part of IEC 62137 is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads.The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress.This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test

BS EN 62421:2007 电子组装技术.电子模块

This International Standard provides a generic standard of electronic modules on which their sectional standards are based. This standard provides a definition, business model, interface between the trading partners, and related areas of standardization of electronic modules. In addition a generic set of test method is provided.

Electronics assembly technology. Electronic modules

DS/EN 62137:2007 环境和耐久性试验 面阵型封装 FBGA、BGA、FLGA、LGA、SON 和 QFN 表面安装板的试验方法

Specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages. Tests for durability against mechanical and thermal stress received during or after the mounting process of discrete semiconductor devices and of integrated circuits used mainly for industrial and consumer use equipment.

Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

DS/EN 62137/Corr. 1:2007 环境和耐久性试验 面阵型封装 FBGA、BGA、FLGA、LGA、SON 和 QFN 表面安装板的试验方法

Specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages. Tests for durability against mechanical and thermal stress received during or after the mounting process of discrete semiconductor devices and of integrated circuits used mainly for industrial and consumer use equipment.

Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

DS/EN 61192-5:2007 焊接电子组件的工艺要求 第5部分：焊接电子组件的返工、修改和修理

This part of IEC 61192 provides information and requirements that are applicable to modification, rework and repair procedures for soldered electronic assemblies. It is applicable to specific processes used to manufacture soldered electronic assemblies where components are attached to printed boards and to the relevant parts of resulting products. The standard is also applicable to activities that can form part of the work in assembling mixed technology products.This part of IEC 61192 also contains guidance on design matters where they have relevance to rework.NOTE Typical in-process surface-mount rework activities to which this standard applies are shown i

Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies

DS/EN 61190-1-3:2007 电子组装用附件材料 第 1-3 部分：电子级焊料合金以及用于电子焊接应用的助焊剂和非助焊剂固体焊料的要求

This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for “special” electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This standard is a quality control document and is not intended to relate directly to the material's performance in the manufacturing processSpecial electronic grade solders include all solders which do not fully comply with the requirements of standard solder alloys and solder materials listed herein. Ex

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

DIN EN 61192-5:2007 钎焊电子组件的工艺要求.第5部分:钎焊电子组件的再加工、改进和检修

Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies (IEC 61192-5:2007); German version EN 61192-5:2007

KS C IEC 61192-3-2007(2022) 焊接电子组件的工艺要求第3部分:通孔安装组件

Workmanship requirements for soldered electronic assemblies－Part 3：Through-hole mount assemblies

KS C IEC 61192-3-2007(2017) 焊接电子组件工艺要求第3部分:通孔安装组件

Workmanship requirements for soldered electronic assemblies－Part 3：Through-hole mount assemblies