31.190 电子元器件组件 标准查询与下载

GOST R IEC 61192-5-2010 焊接电子组件的工艺要求.第5部分:焊接电子组件的返工,修订和维修

Soldered electronic assemblies. Workmanship requirements. Part 5. Rework, modification and repair

GOST R IEC 61192-4-2010 焊接电子组件的工艺要求.第4部分:终端组件

Soldered electronic assemblies. Workmanship requirements. Part 4. Terminal assemblies

KS C IEC 62137-1-1-2009(2020) 表面安装技术表面安装焊点环境和耐久性试验方法第1－1部分:抗拉强度试验

Surface mounting technology－Environmental and endurance test methods for surface mount solder joint－Part 1－1：Pull strength test

KS C IEC 61188-5-6-2009 印制板和印制板组件？设计和使用第5-6部分:连接（接地/连接）注意事项四边有J形引线的芯片载体

Printed boards and printed board assemblies?Design and use－Part 5-6：Attachment(land/joint) considerations－Chip carriers with J-leads on four sides

KS C IEC 62137-2009(2020) 环境和耐久性试验面阵型封装表面安装板的试验方法FBGA、BGA、FLGA、LGA、SON和QFN

Environmental and endurance testing－Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

KS C IEC 62137-1-2:2009 表面安装技术.表面装配焊接接缝的环境和耐久性试验方法.第1-2部分:剪切强度试验

IEC 62137 중 이 표준은 인쇄회로기판과의 조립시에 IEC 61190에 따라 전자 조

Surface mounting technology－Environmental and endurance test methods for surface mount solder joint－Part 1-2: Shear strength test

KS C IEC 62137-1-2-2009(2020) 表面安装技术表面安装焊点的环境和耐久性试验方法第1-2部分:剪切强度试验

Surface mounting technology－Environmental and endurance test methods for surface mount solder joint－Part 1-2: Shear strength test

KS C IEC 61193-2:2009 质量评估系统.第2部分:电子元件和包装件检验用抽样检验方法的选择和使用

KS C IEC 61193 중 이 표준은 전자부품 및 인쇄회로기판의 검사시에 따른 전자적

Quality assessment systems-Part 2:Selection and use of sampling plans for inspection of electronic components and packages

KS C IEC 61193-1:2009 质量评定系统.第1部分:印制版组装件缺陷的登记和分析

KS C IEC 61193 중 이 표준은 인쇄회로기판과의 조립시에 남땜된 인쇄회로기판 부품

Quality assessment systems－Part 1：Registration and analysis of defects on printed board assemblies

KS C IEC 62137:2009 环境和耐用试验.区域阵列式包装件表面安装板的试验方法FBGA、BGA、FLGA、LGA、SON和QFN

이 표준은 반도체 소자를 제조할 때에 KS C IEC 60068-1에 따라 산업용이나 소비

Environmental and endurance testing－Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

KS C IEC 61193-1-2009(2020) 质量评定体系第1部分:印制板组件缺陷的登记和分析

Quality assessment systems－Part 1：Registration and analysis of defects on printed board assemblies

KS C IEC 61193-2-2009(2020) 质量评定体系第2部分:电子元器件和包装检验抽样方案的选择和使用

Quality assessment systems－Part 2：Selection and use of sampling plans for inspection of electronic components and packages

LST EN 62137-1-5-2009 表面贴装技术 表面贴装焊点的环境和耐久性测试方法 第 1-5 部分：机械剪切疲劳测试（IEC 62137-1-5:2009）

Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test (IEC 62137-1-5:2009)

DS/EN 62137-1-5:2009 表面安装技术 表面安装焊点的环境和耐久性试验方法 第 1-5 部分：机械剪切疲劳试验

The test method described in this part of IEC 62137 applies to area array packages, such as BGA. This test method is designed to evaluate the fatigue life of the solder joints between component leads and lands on a substrate as shown in Figure 1. A temperature cyclic approach is generally used to evaluate the reliability of solder joints. Another method is to mechanically cycle the solder joints to shorten the testing time rather than to produce the strains by changing temperatures. The methodology is the imposition of shear deformation on the solder joints by mechanical displacement instead of relative displacement generated by CTE (coefficient of thermal

Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test

EN 62137-1-5:2009 表面安装技术 表面安装焊点的环境和耐久性试验方法 第 1-5 部分：机械剪切疲劳试验

IEC 62137-1-5:2009 applies to area array packages, such as BGA. This test method is designed to evaluate the fatigue life of the solder joints between component leads and lands on a substrate as shown in Figure 1. A temperature cyclic approach is generally used to evaluate the reliability of solder joints. Another method is to mechanically cycle the solder joints to shorten the testing time rather than to produce the strains by changing temperatures. The methodology is the imposition of shear deformation on the solder joints by mechanical displacement instead of relative displacement generated by CTE (coefficient of thermal expansion) mismatch, as shown in Figure 2. In place of the temperature cycle test, the mechanical shear fatigue predicts the reliability of the solder joints under repeated temperature change conditions by mechanically cycling the solder joints. In this test method, the evaluation requires first to mount the surface mount component on the substrate by reflow soldering, then cyclic mechanical shear deformation is applied to the solder joints until fracture of the solder joints occurs. The properties of the solder joints (for example solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.

Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test

LST EN 62137-1-4-2009 表面贴装技术-表面贴装焊点的环境和耐久性试验方法-第1-4部分：循环弯曲试验（IEC 62137-1-4:2009）

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test (IEC 62137-1-4:2009)

LST EN 62137-1-3-2009 表面安装技术 表面安装焊点的环境和耐久性测试方法 第 1-3 部分：循环跌落测试（IEC 62137-1-3:2008）

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test (IEC 62137-1-3:2008)

DS/EN 62137-1-3:2009 表面贴装技术 表面贴装焊点的环境和耐久性试验方法 第 1-3 部分：循环跌落试验

The test method described in this part of IEC 62137 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs).This test is intended to evaluate the strength of the solder joints of larger sized multi-terminal components and other components in devices (e.g. handheld mobile devices) in the event that the device is dropped. The properties of the solder joints (e.g. solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test

DS/EN 62137-1-4:2009 表面贴装技术 表面贴装焊点的环境和耐久性试验方法 第 1-4 部分：循环弯曲试验

The test method described in this part of IEC 62137 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate.This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate.In this test method, the evaluation requires first to mount the surface mount component on the substrate by reflow soldering, then cyclically bend the substrate to a certain degree of depth

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test

BS EN 62137-1-4:2009 表面安装技术.表面安装焊点的环境忍受力试验方法.周期性挠曲试验

The test method described in this part of IEC 62137 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate. This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate. In this test method, the evaluation requires first to mount the surface mount component on the substrate by reflow soldering, then cyclically bend the substrate to a certain degree of depth until fracture of the solder joints occurs. The properties of the solder joints (e.g, solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Cyclic bending test