31.190 电子元器件组件 标准查询与下载

KS C IEC 61190-1-1:2006 电子组件用连接材料.第1-1部分:电子组件中高质量互连用助焊剂的要求

KS C IEC(또는 IEC) 61190 계열규격 중 이 규격은 전자기기 조립시 양질의 연

Attachment materials for electronic assembly－Part 1－1：Requirements for soldering fluxes for high-quality interconnections in electronics assembly

KS C IEC 61190-1-2:2006 电子组件用连接材料.第1-2部分:电子组件中高质量互连接件用焊剂的要求

KS C IEC(또는 IEC) 61190 계열규격 중 이 규격은 전자기기 조립시 양질의 연

Attachment materials for electronic assembly－Part 1－2：Requirements for solder pastes for high-quality interconnections in electronics assembly

KS C IEC 61190-1-3:2006 电子组件用连接材料.第1-3部分:电子焊接用电子级钎焊合金及有焊剂和无焊剂的固体焊接材料用要求

KS C IEC(또는 IEC) 61190 계열규격 중 이 규격은 전자 등급 땜납 합금, 땜

Attachment materials for electronic assembly－Part 1－3：Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

KS C IEC 61190-1-3-2006(2016) 电子组装用连接材料第1－3部分:电子焊接用电子级焊料合金及助熔剂和非助熔剂固体焊料的要求

Attachment materials for electronic assembly－Part 1－3：Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

KS C IEC 61190-1-1-2006(2016) 电子组装用连接材料第1－1部分:电子组装用高质量互连用焊剂的要求

Attachment materials for electronic assembly－Part 1－1：Requirements for soldering fluxes for high-quality interconnections in electronics assembly

KS C IEC 61190-1-1-2006(2021) 电子组装附件材料第1－1部分:电子组装中高质量互连用焊剂的要求

Attachment materials for electronic assembly－Part 1－1：Requirements for soldering fluxes for high-quality interconnections in electronics assembly

IPC M-105-2006 刚性印制电路板手册

Fabricate boards in accordance with IPC-RB-276, Class 3. Finished boards must meet quality conformance testing and inspection as specified.

Rigid Printed Board Manual

IPC 4821-2006 刚性及多层印制板嵌入式无源器件电容器材料规格

This document describes materials that can be used for the fabrication of embedded passive capacitor devices within the finished printed circuit board substrate. For this document, embedded passive devices and the phrase embedded passives are considered to be equivalent. It provides information on general designations and associated characteristics of embedded passive device (EPD) capacitor materials. The document shall be used as a qualification and conformance standard for these materials.

Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

IEC 61189-2:2006 电气材料、互连结构和组件的试验方法.第2部分:互连结构用材料的试验方法

This part of IEC 61189 provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

LST EN 62137-2004/AC-2005 环境和耐久性测试 面阵型封装 FBGA、BGA、FLGA、LGA、SON 和 QFN 的表面贴装板测试方法（IEC 62137:2004）

Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN (IEC 62137:2004)

IPC 4553-2005 印刷电路板沉浸镀银规格

This standard establishes requirements and other considerations

Specification for Immersion Silver Plating for Printed Circuit Boards

IPC A-610D-2005 承认的电子组件包含勘误表:2005年5月1日

This standard is a collection of visual quality acceptability requirements for electronic assemblies.

Acceptability of Electronic Assemblies Remains Active

IPC A-610D CHINESE-2005 可接受性电子组件

IPC-A610, "Acceptability of Electronic Assemblies", was adopted on 12-FEB-02 for use by the Department of Defense (DoD). Proposed changes by DoD activities must be submitted to the DoD Adopting Activity: Commander, US Army Tank-Automotive and Armaments Command, ATTN: AMSTA-TR-E/IE, Warren, MI 48397-5000. Copies of this document may be purchased from the The Institute for Interconnecting and Packaging Electronic Circuits, 2215 Sanders Rd, Suite 200 South, Northbrook, IL 60062.

Acceptability of Electronic Assemblies

IPC 9691-2005 导电阳极丝(CAF)电阻测试(电化学迁移测试),方法2.6.25,IPC-TM-650用户指南

This document is the product of the IPC Electrochemical Migration (ECM) Task Group. It was drafted to provide guidance regarding how the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance test can best be used for evaluating the effects of mechanical stress, laminate material fracturing, ionic contamination, moisture content prior to press lamination, and other material processing characteristics on conductive anodic filament (CAF) growth. This CAF test method provides a proven standard for determining the risk of THB failure within rather than on the surface of printed circuit boards (PCBs), typically filament formation along the boundary between the resin and laminate reinforcement.

User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing)

LST EN 62137-2004 环境和耐久性测试 面阵型封装 FBGA、BGA、FLGA、LGA、SON 和 QFN 的表面贴装板测试方法（IEC 62137:2004）

Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN (IEC 62137:2004)

IPC 9194-2004 应用于印制电路板组装制造指引的统计过程控制(SPC)

The IPC-9194 should be used in conjunction with IPC- 9191. The IPC-9191 provides general guidelines for implementing SPC in electronics industry.

Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline

IPC 2141A-2004 适用于高速控制阻抗电路板的设计指南

This guide is intended to be used by circuit designers, packaging engineers, printed board fabricators, and procurement personnel so that all may have a common understanding of each other’s area.

Design Guide for High-Speed Controlled Impedance Circuit Boards

IPC 2581-2004 印制电路板装配产品制造描述数据和传递方法包含通用要求,修正1:2007年5月

This standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most useful when the manufacturing cycle includes computer-aided processes and numerical control machines.

Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology Incorporates Amendment 1: 5/2007

IPC 7912A-2004 印刷电路板组件最终产品

This document is intended to define standard methods for the categorization of defects related to electronic printed board assemblies (PBAs). This document will provide consistent methodologies for calculating the following benchmark indices:

End-Item DPMO for Printed Circuit Board Assemblies

IPC CM-770E-2004 印制电路板组件安装准则

This document provides information for preparation of components for assembly to printed boards, contains a review of some pertinent design criteria, impacts and issues, techniques of general interest for assembly (both manual and machines) and discusses considerations of, and impacts upon, subsequent soldering, cleaning, and coating processes. The information herein consists of compiled data representing commercial and industrial applications.

Guidelines for Printed Board Component Mounting