31.190 电子元器件组件 标准查询与下载

LST EN 61192-1-2003 焊接电子组件的工艺要求 第1部分：总则（IEC 61192-1:2003）

Workmanship requirements for soldered electronic assemblies. Part 1: General (IEC 61192-1:2003)

LST EN 61188-5-6-2003 印制板和印制板组件 设计和使用 第 5-6 部分：附件（土地/接头）注意事项 四侧带 J 型引线的芯片载体（IEC 61188-5-6:2003）

Printed boards and printed board assemblies. Design and use - Part 5-6: Attachment (land/joint) considerations. Chip carriers with J-leads on four sides (IEC 61188-5-6:2003)

LST EN 61192-4-2003 焊接电子组件的工艺要求 第4部分：端子组件（IEC 61192-4:2002）

Workmanship requirements for soldered electronic assemblies. Part 4: Terminal assemblies (IEC 61192-4:2002)

LST EN 61192-3-2003 焊接电子组件的工艺要求 第3部分：通孔安装组件（IEC 61192-3:2002）

Workmanship requirements for soldered electronic assemblies. Part 3: Through-hole mount assemblies (IEC 61192-3:2002)

LST EN 61192-2-2003 焊接电子组件的工艺要求 第2部分：表面贴装组件（IEC 61192-2:2003）

Workmanship requirements for soldered electronic assemblies. Part 2: Surface-mount assemblies (IEC 61192-2:2003)

DIN EN 61192-4:2003 钎焊电子组件的工艺要求.第4部分:终端组件

This part of IEC 61192 specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates atteched to the surface(s) of inorganic substrates.

Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies (IEC 61192-4:2002); German version EN 61192-4:2003

DIN EN 61192-1:2003 钎焊电子组件的工艺要求.第1部分:总则

This part of IEC 61192 specifies general requirements for workmanship in soldered electronic assemblies on printed boards and on similar laminates attached to the surface(s) of organic substrates.

Workmanship requirements for soldered electronic assemblies - Part 1: General (IEC 61192-1:2003); German version EN 61192-1:2003

DIN EN 61192-2:2003 钎焊电子组件的工艺要求.第2部分:表面安装组件

This part of IEC 61192 specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates.

Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies (IEC 61192-2:2003); German version EN 61192-2:2003

DIN EN 61192-3:2003 钎焊电子组件的工艺要求.第3部分:通孔安装组件

This part of IEC 61192 specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates.

Workmanship requirements for soldered electric assemblies - Part 3: Through-hole mount assemblies (IEC 61192-3:2002); German version EN 61192-3:2003

DS/EN 62090:2003 使用条形码和二维符号的电子元件产品包装标签

This standard applies to labels on the packaging of electronic components for automatic handling. These labels use linear bar code and two-dimensional (2D) symbols. Labels for direct product marking and shipping labels are excluded. Labels required on the packaging of electronic components that are intended for the retail channel of distribution are also excluded from this standard.

Product package labels for electronic components using bar code and two-dimensional symbologies

DS/EN 61192-4:2003 焊接电子组件的工艺要求 第4部分：端子组件

This part of IEC 61192 specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or mixed assemblies that include surface-mounting or other related assembly technologies, for example through-hole, wires.

Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies

DS/EN 61192-3:2003 焊接电子组件的工艺要求 第3部分：通孔安装组件

This part of IEC 61192 specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally trough-hole or mixed assemblies that include surface-mounting or other related assembliy technologies, for example, terminals, wires.

Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies

DS/EN 61192-2:2003 焊接电子组件的工艺要求 第2部分：表面贴装组件

This part of IEC 61192 specifies requirments for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of organic substrates. It applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting. It does not include metal or ceramic-based hybrid circuits in which the conductor metallization is deposited directly on a ceramic substrate or into a ceramic-coated metal substrate.

Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies

DS/EN 61192-1:2003 焊接电子组件的工艺要求 第1部分：总则

This part of IEC 61192 specifies general requirements for workmanship in soldered electronic assemblies on printed boards and on similar laminates attached to the surface(s) of organic substrates. This standard does not include hybrid circuits in which the conductor metallization is deposited directly on a ceramic substrate or onto a ceramic-coated metal substrate. It includes multichip modules assembled on organic substrates but excludes them when they are assembled on inorganic substrate surfaces such as ceramic or silicon.

Workmanship requirements for soldered electronic assemblies - Part 1: General

ANSI/VITA 32-2003 PMC处理器

This standard incorporates a set of extensions to the IEEE 1386.1 PMC ("PCI Mezzanine Card") standard which creates a new class of CPU based PMC cards referred to in this standard as Processor PMC cards. The standard retains electrical signaling compatibility with existing PMC cards.

Processor PMC

NF C90-730-2:2003 钎焊电子组件的工艺要求.第2部分:表面安装组件

Workmanship requirements for soldered electronic assemblies - Part 2 : surface-mount assemblies.

BS EN 61192-4:2003 钎焊电子组件的工艺要求.终端组件

This part of IEC 61192 specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or mixed assemblies that include surface-mounting or other related assembly technologies, for example through-hole, wires.

Workmanship requirements for soldered electronic assemblies - Terminal assemblies

BS EN 61192-1:2003 钎焊电子组件的工艺要求.总则

This part of IEC 61192 specifies general requirements for workmanship in soldered electronic assemblies on printed boards and on similar laminates attached to the surface(s) of organic substrates. This standard does not include hybrid circuits in which the conductor metallization is deposited directly on a ceramic substrate or onto a ceramic-coated metal substrate. It includes multichip modules assembled on organic substrates but excludes them when they are assembled on inorganic substrate surfaces such as ceramic or silicon. The purpose of this standards is: a) to define requirements and guidelines for good workmanship and practice in the preparation, soldering, inspection and testing of electronic and electrical assemblies; b) to enable achievement of high yields and high product quality through process control in production: c) to enable the suppliers and users of electronic assemblies to specify good manufacturing practice as part of a contract.

Workmanship requirements for soldered electronic assemblies - General

BS EN 61188-5-6:2003 印制板和组件.设计和使用.附件条件.四面带有J形引线的片状载体

This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. The object of this standard is to provide the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of resulting solder joints. Each clause contains a specific set of criteria, setting out details on the component, the component dimensions, the solder joint design and the land pattern dimensions. NOTE The acronym QFJ is the naming convention used by Japan; the acronym PLCC is the naming convention used by the USA for these components.

Printed boards and assemblies - Design and use - Attachment (land/joint) considerations - Chip carriers with J-leads on four sides

BS EN 61192-2:2003 钎焊电子组件的工艺要求.表面安装组件

This part of IEC 61192 specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting. It does not include metal or ceramic-based hybrid circuits in which the conductor metallization is deposited directly on a ceramic substrate or onto a ceramic-coated metal substrate.

Workmanship requirements for soldered electronic assemblies - Surface-mount assemblies