31.190 电子元器件组件 标准查询与下载
共找到 380 条与 电子元器件组件 相关的标准，共 26 页
本文件规定在线绝缘测量仪绿色设计产品的评价方法、评价要求，以及产品生命周期评价报告编制方法。 本文件适用于35kV及以下电力系统在线绝缘测量仪系列产品，其它在线绝缘测量仪可参照执行。
Technical specification for evaluation of green design products assessment —Online insulating measuring instrument
- ICS
- 31.190
- CCS
- C3990
- 发布
- 2022-05-30
- 实施
- 2022-06-20
Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries
- ICS
- 31.190
- CCS
- 发布
- 2022-04-27
- 实施
Attachment materials for electronic assembly — Part 1-3:Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
- ICS
- 31.190
- CCS
- 发布
- 2021-12-02
- 实施
Attachment materials for electronic assembly — Part 1-3:Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
- ICS
- 31.190
- CCS
- 发布
- 2021-12-02
- 实施
Attachment materials for electronic assembly —Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
- ICS
- 31.190
- CCS
- 发布
- 2021-12-02
- 实施
Attachment materials for electronic assembly —Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
- ICS
- 31.190
- CCS
- 发布
- 2021-12-02
- 实施
Surface mounting technology -- Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering (IEC 61760-3:2021)
- ICS
- 31.190
- CCS
- 发布
- 2021-11-03
- 实施
- 2021-11-03
本标准从雾化电子烟装置及其释放物入手，对雾化电子烟装置和释放物进行了术语定义，制定通用安全要求，通过对雾化电子烟装置的物理性能要求、电气性能要求、环境适应性要求、化学性能要求，以及对释放物的羰基化合物、亚硝胺、酚类化合物、重金属等指标，确定测试内容，并针对要求和指标给出对应的试验方法，对试验规则进行详细的说明，并最终对雾化电子烟装置的标签、标识、包装、说明书、运输、贮存进行了规定。
General technical specifications for atomizing electronic cigarette devices
- ICS
- 31.190
- CCS
- C419
- 发布
- 2021-09-16
- 实施
- 2021-09-26
Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate
- ICS
- 31.190
- CCS
- 发布
- 2021-07-07
- 实施
IEC 62739-3:2017 describes the selection methodology of an appropriate evaluating test method for the erosion of the metal materials without or with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
- ICS
- 31.190
- CCS
- 发布
- 2021-07-01
- 实施
IEC 62739-2:2016 provides an evaluating test method for the erosion of the metallic materials with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder. It aims at prevention of an accident or a fire by predicting a setup and life of a suitable maintenance cycle.
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
- ICS
- 31.190
- CCS
- 发布
- 2021-07-01
- 实施
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
- ICS
- 31.190
- CCS
- 发布
- 2021-06-22
- 实施
Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering (IEC 61760-3:2021)
- ICS
- 31.190
- CCS
- 发布
- 2021-05-31
- 实施
- 2021-05-31
Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
- ICS
- 31.190
- CCS
- K04
- 发布
- 2021-05-01
- 实施
Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices
- ICS
- 31.190
- CCS
- 发布
- 2021-03-19
- 实施
Surface mounting technology – Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
- ICS
- 31.190
- CCS
- 发布
- 2021-03-16
- 实施
- 2021-03-16
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
- ICS
- 31.190
- CCS
- 发布
- 2021-02-04
- 实施
前言 ···························································································································· III 1 范围 ·························································································································· 1 2 规范性引用文件 ·········································································································· 1 3 术语和定义 ················································································································· 1 4 产品分类 ···················································································································· 1 4.1 产品代号 ··············································································································· 1 4.2 产品分类 ··············································································································· 1 5 技术要求 ···················································································································· 2 5.1 化学成分 ················································································································ 2 5.2 电阻率 ·················································································································· 2 5.3 直径及极限偏差 ······································································································ 2 5.4 力学性能 ··············································································································· 3 5.5 表面质量 ··············································································································· 5 5.6 卷曲和扭曲 ············································································································ 6 5.7 绕丝 ····················································································································· 6 5.8 放丝 ····················································································································· 6 6 试验方法 ···················································································································· 6 7 检验规则 ···················································································································· 6 7.1 检验分类 ··············································································································· 6 7.2 检验项目 ··············································································································· 6 7.3 组批规则和抽样方案 ································································································ 7 7.4 判定规则 ··············································································································· 7 8 标志、包装、运输和储存 ······························································································ 8 8.1 标志 ····················································································································· 8 8.2 包装 ····················································································································· 8 8.3 运输 ····················································································································· 8 8.4 储存 ····················································································································· 8 9 质量证明文件·············································································································· 8
Silver-gold alloy wire for semiconductor packaging bonding
- ICS
- 31.190
- CCS
- C4090
- 发布
- 2021-01-19
- 实施
- 2021-08-10
Circuit boards and circuit board assemblies - Design and use - Part 8: 3D shape data for CAD component library
- ICS
- 31.190
- CCS
- 发布
- 2021-01-14
- 实施
Installation of surface-mounted products on printed circuit boards. Design methods
- ICS
- 31.190
- CCS
- 发布
- 2021-00-00
- 实施
- 2021-12-01
