L94 电子设备机械结构件 标准查询与下载

BS DD IEC/TS 62610-3:2010 电子设备用机械结构.符合IEC 60297及60917系列标准的机壳热量管理.设计指南.热电冷却系统用评估方法(珀尔帖效应)

Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Design guide - Evaluation method for thermoelectrical cooling systems (Peltier effect)

BS DD IEC/TS 62610-1:2010 电子设备用机械结构.符合IEC 60297及IEC 60917系列标准的机壳热量管理.设计指南.热电冷却系统接口尺寸和规定(珀尔帖效应)

Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Design guide - Interface dimension and provision for thermoelectrical cooling systems (Peltier effect)

IEC TS 62610-3:2009 电子设备的机械结构.符合IEC 60297和IEC 60917系列的机柜热管理.第3部分:设计指南:热电冷却系统的评估方法（珀耳帖效应）

Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 3: Design guide: Evaluation method for thermoelectrical coolin

IEC 60917-1:2009 电子设备用机械结构的开发模块化规则.第1部分:一般标准

Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard

BS EN 60297-3-100:2009 电子设备的机械结构.482.6mm(19in)系列机械结构的尺寸.面板、辅助支架、底架、支架和机箱的基础尺寸

This part of IEC 60297 specifies the basic dimensions of front panels, subracks, chassis, racks and cabinets of the 482,6 mm (19 in) series. Subsequent standards of the associated IEC 60297-3 series provides detail dimensions for specific parts of the equipment practice, where the basic dimensions are used as interface to other associated parts.

Mechanical structures for electronic equipment — Dimensions of mechanical structures of the 482,6 mm (19 in) series — Part 3-100: Basic dimensions of front panels, subracks, chassis, racks and cabinets

BS EN 60297-3-105:2009 电子设备用机械结构件.482.6mm(19in)系列机械结构件尺寸.1U高底架用尺寸和设计方面

This part of IEC 60297 specifies the dimensions for 1U chassis mounted into IEC 60297-3- 100 compliant racks/cabinets where dimensions, loaded weight and accessibility require differing assembly methods. Guidance for cooling and reference for EMC, seismic and for the climatic and mechanical requirements and tests are provided, as defined in the IEC 61587 series. The drawings used in this standard are not intended to indicate product design, only the specific dimensions shall be used. The terminology used complies with IEC 60917-1.

Mechanical structures for electronic equipment — Dimensions of mechanical structures of the 482,6 mm (19 in) series — Part 3-105: Dimensions and design aspects for 1U high chassis

IEC 48D/393/DTS:2009 IEC 62610-1,Ed.1.0:电子设备用机械结构件.依照IEC 60297和IEC 60917机壳用热管理.第1部分:设计指南:电气提高的制冷系统用接口尺寸和规定(珀耳帖效应)

IEC 62610-1, Ed. 1.0: Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 - Part 1: Design guide: Interface dimensions and provisions for electrical advanced cooling systems (Peltier

ANSI/VITA 58.0-2009 现场可置换集成电子底盘标准草案

The objective of this standard is to identify the common requirements for a chassis capable of accommodating VITA 46, VITA 48 types of modules for use in rugged environments.

Line Replaceable Integrated Electronics Chassis Draft Standard

IEC 60297-3-100:2008 电子设备用机械结构件.482.6mm(19 in)系列机械结构件的尺寸.第3-100部分:面板、辅助支架、底架、支架和机箱的基础尺寸

This part of IEC 60297 specifies the basic dimensions of front panels, subracks, chassis, racks and cabinets of the 482,6 mm (19 in) series. Subsequent standards of the associated IEC 60297-3 series provides detail dimensions for specific parts of the equipment practice, where the basic dimensions are used as interface to other associated parts.

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-100: Basic dimensions of front panels, subracks, chassis, racks and cabinets

IEC 60297-3-105:2008 电子设备用机械结构件.482.6mm(19in)系列机械结构件尺寸.第3-105部分:1U高底架用尺寸和设计方面

This part of IEC 60297 specifies the dimensions for lU chassis mounted into IEC 60297-3- 100 compliant racks/cabinets where dimensions, loaded weight and accessibility require differing assembly methods. Guidance for cooling and reference for EMC, seismic and for the climatic and mechanical requirements and tests are provided, as defined in the IEC 61587 series. The drawings used in this standard are not intended to indicate product design, only the specific dimensions shall be used. The terminology used complies with IEC 60917-1.

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-105: Dimensions and design aspects for 1U high chassis

IEC 62047-4:2008 半导体装置.微电机装置.第4部分:MEMS用总规范

This part of IEC 62047 describes generic specifications for micro-electromechanical systems (MEMS) made by semiconductors, which are the basis for specifications given in other parts of this series for various types of MEMS applications such as sensors, RF MEMS, excluding optical MEMS, bio MEMS, micro TAS, and power MEMS. This standard specifies general procedures for quality assessment to be used in IECQ-CECC systems and establishes general principles for describing and testing of electrical, optical, mechanical and environmental characteristics. This part of IEC 62047 aids in the preparation of standards that define devices and systems made by micromachining technology, including but not limited to, material characterization and handling, assembly and testing, process control and measuring methods. MEMS described in this standard are basically made of semiconductor material. However, the statements made in this standard are also applicable to MEMS using materials other than semiconductor, for example, polymers, glass, metals and ceramic materials.

Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specifications for MEMS

SJ/T 3233-2008 真空电子器件电子枪支架玻杆

本标准规定了真空电子器件用支架玻杆（简称支架玻杆）的品种规格、技术要求、检验方法、检验 规则及标志、包装、运输和贮存。

Vacuum electronic apparatus electronic gun bead glass

BS DD IEC/TS 62454:2007 电子设备用机械结构.设计指南.IEC60297和IEC60917系列带壳体电子设备的水冷却用接口尺寸和设备

This technical specification provides interface dimensions and cooling performance guidelines for cabinets, using water supplied heat exchangers. For a clear definition of interface dimensions and cooling performance guidelines, only cabinets have been regarded from the IEC 60297 (19 in) and IEC 60917 (25 mm) series. As the cooling performance is in direct relation to volume flows and temperatures of air and water, cooling performance guidelines are provided for two structural interface levels – Interface level 1 and 2 – of equipment built into cabinets. The third interface level is only described by main interfaces, but without detailed dimensions and without cooling performance guidelines. This interface needs very complex details for the ducting of water supply within the cabinet and down to the component heat sinks on boards within subracks. Therefore, only the principle is shown usable for individual design solutions.

Mechanical structures for electronic equipment - Design guide - Interface dimensions and provisions for water cooling of electronic equipment within cabinets of the IEC 60297 and IEC 60917 series

DIN EN 61587-1:2007 电子设备的机械结构.IEC 60917和IEC 60297的试验.第1部分:机箱、支架、辅助支架和底盘的气候试验、机械试验和安全状况

Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 1: Climatic, mechanical tests and safety aspects for cabinets, racks, subracks and chassis (IEC 61587-1:2007); German version EN 61587-1:2007

IEC TS 62454:2007 电子设备机械结构.设计指南:IEC60297和IEC60917系列标准包含的电子设备水冷却用接口的尺寸和规定

This technical specification provides interface dimensions and cooling performance guidelines for cabinets, using water supplied heat exchangers. For a clear definition of interface dimensions and cooling performance guidelines, only cabinets have been regarded from the IEC 60297 (19 in) and IEC 60917 (25 mm) series. As the cooling performance is in direct relation to volume flows and temperatures of air and water, cooling performance guidelines are provided for two structural interface levels – Interface level 1 and 2 – of equipment built into cabinets. The third interface level is only described by main interfaces, but without detailed dimensions and without cooling performance guidelines. This interface needs very complex details for the ducting of water supply within the cabinet and down to the component heat sinks on boards within subracks. Therefore, only the principle is shown usable for individual design solutions.

Mechanical structures for electronic equipment - Design guide: Interface dimensions and provisions for water cooling of electronic equipment within cabinets of the IEC 60297 and IEC 60917 series

NF C93-471-1:2007 电子设备的机械结构.IEC 60917和IEC 60297的试验.第1部分:壳体、支架、辅助支架和底盘的气候、机械试验和安全方面

Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 1 : climatic, mechanical tests and safety aspects for cabinets, racks, subracks and chassis.

SJ 20971-2007 机载电子设备机箱.B类前锁紧装置规范

本规范规定了机载电子设备机箱 B 类前锁紧装置的详细要求。 本规范适用于机载电子设备机箱 B 类前锁紧装置（以下简称 B 类前锁紧装置）。

Specification for front locking device.type B of avionics cases

GEIA EIA-748-B-2007 价值管理系统

An Earned Value Management System (EVMS) for program management will effectively integrate the work scope of a program with the schedule and cost elements for optimum program planning and control.

Earned Value Management Systems

DIN EN 61587-3:2007 电子设备用机械结构.IEC 60917和IEC 60297的试验.第3部分:机箱、支架和辅助支架的电磁屏蔽性能试验

Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 3: Electromagnetic shielding performance tests for cabinets, racks and subracks (IEC 61587-3:2006); German version EN 61587-3:2006

BS EN 61587-1:2007 电子设备机械结构.用于IEC 60917和IEC 60297标准的试验.机箱,支架,辅助框架和底盘的耐环境试验,机械试验和安全性方面性能

This part of IEC 61587 specifies mechanical tests, climatic tests and safety aspects for cabinets, racks, subracks and chassis as defined in the standards of the IEC 60917 series and the IEC 60297 series for indoor applications. It applies in whole or part only to the mechanical structures of cabinets, racks, subracks and chassis, but it does not apply to electronic equipment or systems. Tests dedicated to outdoor enclosures are standardized in IEC 61969-3. Some suitable parts of IEC 61587-1 apply to IEC 61969-3.

Mechanical structures for electronic equipment. Tests for IEC 60917 and IEC 60297. Climatic, mechanical tests and safety aspects for cabinets, racks, subracks and chassis