【技术特点】-- ETD-900M磁控溅射仪

ETD-900M 型离子溅射仪外观亮丽做工精致磁控溅射是物理气相沉积的一种。一般的溅射法可被用于制备金属、半导体、绝缘体等多材料，且具有设备简单、易于控制、镀膜面积大和附着力强等优点，磁控溅射法更是实现了高速、低温、低损伤。因为是在低气压下进行高速溅射，必须有效地提高气体的离化率。磁控溅射通过在靶阴极表面引入磁场，利用磁场对带电粒子的约束来提高等离子体密度以增加溅射率。

      配有高位定性的飞跃真空泵

  The ETD-900M ion sputtering apparatus has beautiful appearance and exquisite workmanship.

  Magnetron sputtering is a kind of Physical Vapor Deposition (PVD). The general sputtering method can be used to prepare materials such as metal, semiconductor, insulator and so on. It has the advantages of simple equipment, easy control, large coating area and strong adhesion. The magnetron sputtering method has achieved high speed, low temperature and low damage. Because of the high velocity sputtering at low pressure, the ionization rate of gas must be increased effectively. Magnetron sputtering improves the plasma density by increasing the plasma density by introducing magnetic field on the cathode surface and confining the charged particles by magnetic field.

Equipped with high stability of vacuum pump

【技术特点对用户带来的好处】-- ETD-900M磁控溅射仪

【典型应用举例】-- ETD-900M磁控溅射仪