【技术特点】-- 薄膜应力量测仪Line Card

Line Card

3DIC TSV and BWS TTV硅片表面形貌测量
Film Stress薄膜应力量测仪
FEOL Electrical Characterization 电学特性
Thin wafer metrology 晶圆测量学
Film Adhesion漆膜附着力测试Global Film Stress Adhesion
Local and Lattice Stress
Thickness, Topography & Geometry
Contact and Non-Contact Sheet Resistance

Metrology Tools forSemiconductor, LED, Solar, FPD, MEMS, Data Storage

【技术特点对用户带来的好处】-- 薄膜应力量测仪Line Card

【典型应用举例】-- 薄膜应力量测仪Line Card