The capping of microfluidic features fabricated in glass substrates is achievable by various technological methods. Of the entire spectrum of possibilities (gluing, glass bonding via intermediate layers, pressure or plasma-assisted glass bonding, etc.) a detailed description of three techniques is presented here. The first is a low temperature PDMS-glass adhesion bonding, the second is medium temperature pressure assisted glass–glass bonding, and finally, high temperature glass–glass fusion bonding. All these protocols allow completion of the manufacturing process for a fully enclosed microfluidic chip. Nevertheless, as they are complementary rather than competing methods, they effectively extend the range of tools available to fabricate lab-on-a-chip microdevices. Each has its own merits and each could feasibly be used at different developmental stages of a given microfluidic device.