This International Standard specifies the requirements for chemical composition for the following families of soft solder alloys: — tin-lead, with and without antimony, bismuth, cadmium, copper, and silver; — tin-antimony; — tin-bismuth; — tin-copper, with and without silver; — tin-indium, with and without silver and bismuth; — tin-silver, with and without copper and bismuth; — tin-zinc, with and without bismuth. It also includes an indication of the forms generally available.