NF C96-013-6-8*NF EN 60191-6-8:2002 半导体器件的机械标准化 第6-8部分:半导体器件包装用表面安装略图制备的一般规则 玻璃密封的陶瓷四方块的设计指南(G-QFP)
Mechanical standardization of semiconductor devices - Part 6-8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)