This part of IEC 60749 provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. This test method is in general accord with IEC 60068-2-14 but, due to specific requirements of semiconductors, the clauses of this standard apply. This test method applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing. In single chamber cycling, the load is placed in a stationary chamber and is heated or cooled by introducing hot, ambient or cold air into the chamber. In dual chamber cycling, the load is placed on a moving platform that shuttles between stationary chambers maintained at fixed temperatures. In triple chamber temperature cycling, the load is moved between the three chambers.