DD IEC/PAS 62326-14:2010

Printed boards - Device embedded substrate. Terminology / reliability / design guide


说明:

  • 此图仅显示与当前标准最近的5级引用;
  • 鼠标放置在图上可以看到标题编号;
  • 此图可以通过鼠标滚轮放大或者缩小;
  • 表示标准的节点,可以拖动;
  • 绿色表示标准:DD IEC/PAS 62326-14:2010 , 绿色、红色表示本平台存在此标准,您可以下载或者购买,灰色表示平台不存在此标准;
  • 箭头终点方向的标准引用了起点方向的标准。

 

 

非常抱歉,我们暂时无法提供预览,您可以试试: 免费下载 DD IEC/PAS 62326-14:2010 前三页,或者稍后再访问。

点击下载后,生成下载文件时间比较长,请耐心等待......

 



标准号
DD IEC/PAS 62326-14:2010
发布
2010年
发布单位
英国标准学会
当前最新
DD IEC/PAS 62326-14:2010
 
 
适用范围
What is DD IEC/PAS 62326-14 -  Design guide for Printed boards about?    DD IEC/PAS 62326-14 is the 14th part of a multi-series standard used for printed boards.   DD IEC/PAS 62326-14 describes the substrate embedding devices including but not limited to the module, integrated passive device (IPD), microelectrochemical systems (MEMS), discrete component formed in the fabrication process of the electronic wiring board, and sheet form component. Figure 1 shows examples of device embedding in the fabrication process of the device embedded substrate. Active and passive devices are connected to each other by interlayer vias and/or conductor patterns. Insulating layers are formed using insulating materials with vias for the connection of inside conductor patterns to the conductor patterns formed on the surface(s) of the substrate. Figure 2 shows the substrate with connections using pads, and Figure 3 shows the board using via connections.   The insulating layer includes rigid and flexible insulating resins such as phenol resin, epoxy   resin, polyimide resin, and modified polyimide resin, which are reinforced with glass cloth,

DD IEC/PAS 62326-14:2010相似标准





Copyright ©2007-2022 ANTPEDIA, All Rights Reserved
京ICP备07018254号 京公网安备1101085018 电信与信息服务业务经营许可证:京ICP证110310号