BS 4584-103.3:1992(1999)*IEC 249-3A:1976
印刷线路板用金属包覆基材 第103部分:印刷电路连接用特殊材料 第 103.2 节 用于制造覆铜基材的铜箔规范
Metal - clad base materials for printed wiring boards — Part 103 : Special materials used in connection with printed circuits — Section 103.2 Specification for copper foil for use in the manufacture of copper - clad base materials