IEC 61163-1-2006
可靠性应力筛选.第1部分:批生产可修复产品
Reliability stress screening - Part 1: Repairable assemblies manufactured in lots
IEC 61163-1-2006 发布历史
This part of IEC 61163 describes particular methods to apply and optimize reliability stress screening processes for lots of repairable hardware assemblies, in cases where the assemblies have an unacceptably low reliability in the early failure period, and when other methods, such as reliability growth programmes and quality control techniques, are not applicable. The reasons for using reliability stress screening may be time constraints and/or the very nature of the deficiencies that the reliability stress screening is designed to catch. The processes apply to any stage of a series production of repairable assemblies (see Figure 3). The methods for setting up a process can be used during production planning, during pilot-production, as well as during well-established running production. A prerequisite for the application of the methods is that a certain level of flaws remaining in the outgoing assembly can be specified. The processes described are general processes for reliability stress screening in cases where no specific process is described in a product standard. They are also intended for use by IEC committees in connection with preparation of product standards. A reliability stress screening process can form part of an overall reliability programme (see IEC 60300-2).
IEC 61163-1-2006由国际电工委员会 IX-IEC 发布于 2006-06。
IEC 61163-1-2006 在中国标准分类中归属于: K04 基础标准和通用方法，在国际标准分类中归属于: 03.120.01 质量综合,03.120.30 统计方法的应用,21.020 机器、装置、设备的特性和设计,29.020 电气工程综合,31.020 电子元器件综合。
IEC 61163-1-2006 发布之时，引用了标准
- 170 *， 2017-01-01 更新
* 在 IEC 61163-1-2006 发布之后有更新，请注意新发布标准的变化。
IEC 61163-1-2006的历代版本如下：
- 1995年07月 IEC 61163-1-1995 可靠性应力筛选 第1部分:批生产可修复产品
- 2006年06月 IEC 61163-1-2006 可靠性应力筛选.第1部分:批生产可修复产品
- 标准号
- IEC 61163-1-2006
- 发布日期
- 2006年06月
- 实施日期
- 废止日期
- 无
- 中国标准分类号
- K04
- 国际标准分类号
- 03.120.01;03.120.30;21.020;29.020;31.020
- 发布单位
- 国际电工委员会
- 被代替标准
- IEC 56/1102/FDIS-2006 IEC 61163-1-1995 IEC 61163-1 Corrigendum 1-1999
- 适用范围
- This part of IEC 61163 describes particular methods to apply and optimize reliability stress screening processes for lots of repairable hardware assemblies, in cases where the assemblies have an unacceptably low reliability in the early failure period, and when other methods, such as reliability growth programmes and quality control techniques, are not applicable. The reasons for using reliability stress screening may be time constraints and/or the very nature of the deficiencies that the reliability stress screening is designed to catch. The processes apply to any stage of a series production of repairable assemblies (see Figure 3). The methods for setting up a process can be used during production planning, during pilot-production, as well as during well-established running production. A prerequisite for the application of the methods is that a certain level of flaws remaining in the outgoing assembly can be specified. The processes described are general processes for reliability stress screening in cases where no specific process is described in a product standard. They are also intended for use by IEC committees in connection with preparation of product standards. A reliability stress screening process can form part of an overall reliability programme (see IEC 60300-2).