SAE AMS 3375B-2001
单一室温硫化的抗氟硅酮芳烃燃料粘合剂/密封剂

Adhesive/Sealant, Fluorosilicone Aromatic Fuel Resistant, One-Part Room Temperature Vulcanizing

SAE AMS 3375B-2001 发布历史

This specification covers a one-part fluorosilicone (FVMQ) adhesive/sealant, supplied in cartridges, suitable for extrusion and curing to an elastomeric material upon exposure to air. It also covers a compatible primer. This adhesive/sealant has been used typically for bonding cured fluorosilicone rubber and for sealing applications requiring resistance to fuels, oils, or solvents from -65 to +400 degrees F (-54 to +204 degrees C). but usage is not limited to such applications. This product should not be used for fay surface sealing or similar applications where exposure to air cannot be maintained. This product should not be used in thicknesses greater than 0.25 inch (6.4 mm), particularly in applications involving encapsulation.

SAE AMS 3375B-2001由美国机动车工程师协会 US-SAE 发布于 2001-04-01。

SAE AMS 3375B-2001 在中国标准分类中归属于: V13 航空与航天用非金属材料，在国际标准分类中归属于: 49.025.50 粘合剂。

SAE AMS 3375B-2001的历代版本如下：

• 2001年04月01日 SAE AMS 3375B-2001 单一室温硫化的抗氟硅酮芳烃燃料粘合剂/密封剂

SAE AMS 3375B-2001 单一室温硫化的抗氟硅酮芳烃燃料粘合剂/密封剂 于 2012-01-17 变更为 SAE AMS 3375C-2012 单一室温硫化的抗氟硅酮芳烃燃料粘合剂/密封剂。

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标准号

SAE AMS 3375B-2001

发布日期

2001年04月01日

实施日期

废止日期

无

中国标准分类号

V13

国际标准分类号

49.025.50

发布单位

US-SAE

代替标准

SAE AMS 3375C-2012

适用范围

This specification covers a one-part fluorosilicone (FVMQ) adhesive/sealant, supplied in cartridges, suitable for extrusion and curing to an elastomeric material upon exposure to air. It also covers a compatible primer. This adhesive/sealant has been used typically for bonding cured fluorosilicone rubber and for sealing applications requiring resistance to fuels, oils, or solvents from -65 to +400 degrees F (-54 to +204 degrees C). but usage is not limited to such applications. This product should not be used for fay surface sealing or similar applications where exposure to air cannot be maintained. This product should not be used in thicknesses greater than 0.25 inch (6.4 mm), particularly in applications involving encapsulation.