These components can be attached to glass epoxy or alumina substrates by conventional techniques such as vapor-phase or wave soldering and hot plate methods. In general attachment with a soldering iron is not recommended due to the difficulty of consiste
ECA 535BAAB-1987由美国电子元器件、组件及材料协会 US-ECA 发布于 1987-05-01。
ECA 535BAAB-1987 在中国标准分类中归属于: L11 电容器。
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