AIA/NAS NAS 4123-1995
(DIP)双管道包装半导体装置电子元件电子热接收器
Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (DIP)
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- 适用范围
- HEAD M I N G SHALL BE DEPRESSED (.O10 MAX) AND ARRANGED AS FOLLOWS: W E R ("SAS" OPTIONAL) EXCEPT MARK .1.120-40 SIZE. WITH " k " , ,1380-32 SIZE WITH "6" AND ,1640-32 SIZE WITH "8". HARK WITH WUFACTURER'S SYMBOL, GRIP DASH NUMBER, "D", "L" OR "P" WHEN APPLICABLE (1) AND RECESS NUMBER ENCIRCLED. OTHER SWBERS. lit" IDENTIFIES BOLT WITH MARK WITH BASIC THESE SIZES ALSO TO BE MARKED "V" FOR TITANIUW. RECESS NUMBER TO BE APPROXIMATELY 25X LARGER THAN '*DI' IDEKTIFIES BOLT WITH DRILLED S U , "P" IDENTIFIES BOLT WITH PATCH TYPE LOCKING ELDENT ONLY.