The protection of through vias within PrintedWiring Boards
(PWB) has evolved from limited use to common practice.
Technology has evolved where via fabrication techniques
and protection methodologies need to be defined to allow
current designs to be manufacturable at an acceptable yield
and cost. Numerous techniques and objectives exist, and will
be discussed in this document. This document is the product
of the IPC D-33d Via Protection Task Group and has been
developed to provide guidance for the designer and fabricator
on how via protection should be approached as well as
guidance on how via protection should be specified in procurement
documentation.