IPC TM-650 2.2.12.2-1989
铜箔与释放载体的重量和厚度

Weight and Thickness of Copper Foils with Releasable Carriers


 

 

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标准号
IPC TM-650 2.2.12.2-1989
发布
1989年
发布单位
美国电子电路和电子互连行业协会
 
 
适用范围
Electronics manufacturers are faced with the difficult task of proving that a candidate manufacturing process can produce acceptable hardware, either to the customer of the product, or for internal quality control. In the past, assembly level specifications (e.g. MIL-STD-2000A) told you exactly how to go about this demonstration. It wasn’t always precisely correct, but you didn’t have to figure our all of the fine points of the qualification on your own. In our modem era, “how-to” specifications are now evil things and taboo to all involved with them. The users now have to determine many of the process qualification-steps on their own, and sadly, many don’t have the faintest idea where to start. That is the purpose of this document. It makes no assumptions about what you know and leads you through the somewhat complex task of qualifying a candidate process to the B revision of J-STD-001.

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