With the present packaging trend in system design
moving towards compact, low power consumption configurations,
the use of Surface Mount Technology offers a viable
approach toward achieving the desired packaging goals. Sophisticated
electronic assemblers, using a variety of interconnection
and packaging techniques, employ the best of todays
technology, intermixed with the appropriate sfate-of-the-art
component and attachment processes. The degree of advancement
in packaging of electronic components is predicated
on the type of product being produced: the need for
miniaturization and weight savings; plus the off-the-shelf availability
of different component types.